Thermal dissipation phenomena have to be considered from various viewpoints of basic functions such as phonon drift, photon emission, mass transfer and potential transfer. At present, the phonon transfer and mass transfer issues are mainly simulated and analyzed, but they are not enough for the total analysis of thermal dissipation phenomena. Paul D. Franzon, North Carolina State Univ., often says that the SPICE approach would be the most advantageous for the total analysis. Also, Masamitsu Koyanagi, Tohoku Univ., strongly supports this approach. Unfortunately, they have not published any articles so far. We will now try to do analyses by using LTSPICE simulator as a preliminary study to aware with its feasibility. In our analyses only two embedding parameters are used; one is the thermal resistance and the other is the thermal inductance due to inertia of thermal energy transfer. The simulation results show that our method makes it possible to do quick 2-D and 3-D analyses of the total thermal resistances with time dependency.