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A wafer level packaging solution for the X-band microwave power sensor is described based on through wafer via technology in silicon substrate in this paper. The connection between chip and external pin is the critical part of the packaging. A pre-processed silicon capping wafer containing recesses and vertical Cu-plated TWV interconnect is bonded to the microwave power sensor wafer providing environmental...
Microelectronic packaging devices consist of various kinds of materials, such as: die, molding compound, adhesives, copper etc. Due to the mismatch of the materials coefficient of thermal expansion (CTE), thermal stress can accumulate in the device, which would cause the interface delamination of microelectronic packaging devices when ambient temperature changes, and eventually lead to the failure...
In this paper, a pin pull test is introduced as an effective way to assess the PCB pad strength. The pad strength is evaluated by different level of strain, pad type, PCB life phase and accumulation effect of various stations. Finite element analysis (FEA) is employed to analyze whether the PCB material affects the pad strength. It is found that PCB pad strength is sensitive to the rework process,...
As resource consumption and environmental protection have become two major global ecological issues, modern food packaging has become a hot research both abroad and in China. This article describes development of green packaging, environmental protection in international market, and the new packaging ideas which the developed countries contribute to pollution reduction. The article is also analyze...
The scene improvement of productive process is an indispensable aspect for an enterprise. It is the foundation and guarantee of the enterprise's operation and management's success. In this paper, based on the analysis of Jiefang Truck engine production packaging lines, the logistics of the production line, flat layout, handling, balance and work place have been improved. So wastes can be eliminated...
To analyze the effect of moisture on the reliability of LED modules, diffusivity of packaging materials must be provided. Polycarbonate (PC) is an important material for LED lens. Its diffusivity measurement is usually based on the solution of one-dimensional diffusion. In this paper, the diffusivity measurement of PC was conducted. Simulation and analytical close-form solution (CFS) were also used...
The IMC has become an important criterion when assessing the reliability of portable electronics. The quality of solder joints directly determines the drop-impact reliability of the product. As a structural member of the electronic product, IMCs are used to connect the solders and the associated printed circuit board by a proper joining technique such as the surface mount technology (SMT). Inter-metallic...
Materials are one of the key factors of production. The cost of materials supply takes larger proportion of the total cost of logistics in the manufacturing enterprises. The materials supply system is separated from the production logistics system and establishes an efficient and low-cost materials supply management system which is fit for the characteristics of manufacturing industry, considering...
Packaging of electronics is an important technology to interconnect, power, cool and protect the components in highly integrated systems. Continuous size shrinking and function integration of future electronics are expected to be driven mainly by the advances in packaging technology. Carbon nanotubes (CNTs) are proposed for many novel packaging solutions thanks to their unique electrical, thermal,...
Based on the purpose that the effective use and protection of environmental resources, studying the evolution trends of packaging and influencing factors from the life experience, discussing the use beyond the basic function and value extension, the idea of “to make the best use of everything” is offered as the goal to improve the packaging effectiveness of the resource consumption, combined with...
By interviewing pricing experts in computer peripherals, the study covered by this paper focused on pricing strategies and value factors for an in-depth exploration. One of the computer peripherals, the mouse, was used as a sample to interview consumers on how they gave weight to value factors and price tags. Both experts and consumers interviews gave the results as follows. (1) Compared with the...
In order to solve the conflict between accuracy and speed in dynamic quantitative weighing process, the neural network PID controller is designed by means of the neural network theory combined with the PID control theory for the dynamic quantitative weighing system,and proposed the new intelligent control strategy. PID (Proportion Integration Differentiation) controllers are used in a large number...
Taking sealed boxes as the research object, the author analyzes the main source of its moisture content. Based on the permeability mechanism of the sealed boxes and the moisture mechanism of the items inside the boxes, the paper establishes the mathematical model of the relative humidity inside changing over time, applying MATLAB to make a simulation analysis of the mathematical model. The simulation...
Air-gap structures are of interest in a range of microelectronic applications especially in microelectromechanical systems (MEMS). In this work, we investigate the application of an unique trimaterial for MEMS packaging composed of polypropylene carbonate (PPC) as a sacrificial material, a photosensitive, hybrid inorganic/organic dielectric epoxycyclohexyl polyhedral oligomeric silsesquioxanes (POSS)...
The paper sets up and analyzes the game model of government and distribution centers on recycling products packaging with game theory. And the equilibrium is solved. The studies indicate as follows. In the situation of definite cost, benefits for recycling products packaging, and premium put by government, the punishment probability by government becomes smaller, and the recycling probability of distribution...
The rapid development of modern logistics affects the environment increasing sharply and prominently. Environmental logistics management came into being due to the damage on environment by logistics activities. The paper clarifies that both environmental logistics and environment should develop coordinationly and sustainablely based on the analysis of modern environmental logistics influences the...
Current industry trends, combined with present cost pressures shall force signal integrity engineers to revisit traditional “rules of thumb” such that additional bandwidth can be obtained from conventional (standard) packaging materials and methodologies. In this paper, the authors assert that some current design practices prematurely cap the useful bandwidth of current technology, and unnecessarily...
This paper discusses wafer level vacuum sealing technology with evaporated AuSn solder for a microelectromechanical systems (MEMS) resonator without getter material. The MEMS resonator is fabricated and characterized in a vacuum chamber. Relationship between the Q-factor of the MEMS resonator and the vacuum level is established and used as a reference for later vacuum level calibration. Wafer bonding...
Today non-destructive evaluation techniques become more and more important. Consequently, X-ray detectors are suitable tools to get information about specimens. In comparison to the already established scintillation principle, the direct converting method on the basis of semiconductor materials delivers several advantages. Hence, it is necessary to speed this measurement method and develop appropriate...
Today is the era of information and knowledge-based economy, the task of experimental education is to train talented persons with innovative spirit and high ability, packaging engineering experimental teaching platform is to meet this demand, which is supplement and perfection to the traditional laboratory teaching. Interaction design is the basis to built the experimental teaching platform, the quality...
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