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Conventionally, post-temperature cycling reliability tests, polyimide based Print Circuit Board (PCB) offer better solder ball joint reliability than FR4 based PCB. This paper illustrates that for FR4 materials, by applying suitable PCB stack & solder mask design, 1.5 to 2X increase in solder ball joint reliability can be achieved. Reliability improvement is supported by correlation of theoretical...
Degeneration data can provide important life information of solder joints. In this paper, a statistical regression model is proposed to evaluate the failure process of board level solder joints under vibration load. First, the fixed frequency and amplitude vibration test is conducted, and the voltage signals at both sides of the solder joint are collected through a bleeder circuit and a high-speed...
SAC305 solder paste is commonly used electronic assembly. This solder alloy consists of 96.5% tin, 3% silver, and 0.5% copper and melts at 219 °C. The peak reflow temperature range is typically 240 - 260 °C. With electronic devices such as smartphones, notebook PCs, and tablets becoming thinner, packaging substrates, such as ultra-thin flip chip ball grid arrays (FCBAs), and the printed circuit boards...
System-in-Package (SiP) is becoming more and more important in integrating functionality while reducing final product form factors and cost. This is particularly true for mobile applications where continued effort to achieve ever thinning products is continuously pushing development of new materials, components and assembly technologies. This presentation focuses on a SiP flip chip (FC) pad design...
Wafer Level Chip Scale Packaging (WLCSP) designs, including Wafer Level Fan-Out (WLFO) technologies, are gaining more and more applications for next generation small and thin devices. Since the WLCSP and WLFO packages are mounted directly on the motherboard without a substrate as a buffer, the large coefficient of thermal expansion (CTE) mismatch between the silicon die and the motherboard makes the...
Wafer Level Package (WLP) demand has been increasing in proportion to cost competitive device's demand year by year. In order to manufacture the WLP which has higher reliability efficiently, assembly processes with Bump Support Film (BSF) and Backside coating tape has been developed. The BSF consists of Back Grinding tape (BG tape) for getting a function as a wafer thinning and Bump Support Layer...
This paper presents the multiscale approach for investigating the new deformation and failure mechanisms including such deformation modes as single crystal slips and texture evolution as sub-grains and recrystallization. Failure criteria from microvoids and microcracks shall be embedded into constitutive equations for the power of failure process visualization. The constitutive framework developed...
3D IC packages with stacked silicon interconnects (SSI) have many performance advantages over conventional flip chip packages. Using SSI, various die using the same or different technology can be connected to each other with the use of an interposer. The interposer allows a large number of die-to-die connections, enabling higher interconnect bandwidth, lower power consumption, and lower I/O latency...
A high reliability of light emitting diode (LED) light sources is essential for general and automotive lighting applications, where exchange of LED components is expensive. Thermal management of modern high power LEDs is crucial for their lifetime. An important aspect is the thermal path for heat conduction. Many different defects can have an influence on this path of an electronic system: on the...
This paper deals with the area of solder joints reliability and narrower focus is on solder joints on SMD ceramic resistor arrays in configuration 8x0603. These SMD ceramic resistor arrays are soldered on 30 testing boards and every board includes two packages. Testing boards are exposed to influences of temperature changes in the temperature chamber. The range of temperature changes is from −25 °C...
The effect of the variation of processing parameters such as thermal history, or the composition of Sn-Ag-Cu solder joints, on microstructure and reliability performance depends strongly on joint geometry, in particular length scale. The advent of 2.5/3D packaging technologies in microelectronics has further decreased joint length scales and changed interconnect aspect ratios to reduce I/O pitch....
This paper describes a road test using a printed circuit board (PCB) used for automotive applications. In order to characterize the vibration stresses, a series of road tests were conducted which included different automobiles and road conditions such as city and highway. During the road tests, a comprehensive data acquisition system was used which can record temperature, acceleration, driving speed,...
In this paper, the intermetallic layer growth of the Innolot solder alloy (Sn/3.8Ag/0.7Cu/3Bi/1.5Sb/0.2Ni) has been investigated. A testboard was designed for 0603 size (1.5 × 0.75 mm) surface mounted resistors. The solder paste was deposited by stencil printing with a 100 μm thick, lasercut stencil. The components were soldered with vapour phase soldering. After the soldering, testboards were subjected...
The assessment of board level solder joint reliability during thermal cycling is very important for electronic packages. During thermal cycling, the mismatch in Coefficient of Thermal Expansion (CTE) between the materials used in the package induces stress on the solder interconnects and results in deformation and stresses. Finite element tools are widely used for rapid design optimization and also...
Wafer-level chip-scale package (WLCSP) with solder joint as interconnection process was used to enable, thinner, low cost and fine-pitch for mobile type of information and communication device that assembly into SiP module. However, the lower solder joint reliability performances is the key challenge and more and more serious as increasing WLCSP package size, especially the size is larger than 6mm...
In traditional Quad Flat Package(QFP), solder joint quality and electrical analysis always been a critical issue. In original PCB land pad design, thermal opening is the same size of QFP thermal pad. In this design, solder joint yield is about 87.5%. In order to overcome this problem, this paper proposes a new PCB land pad design as a solution. Let PCB thermal opening 25% of QFP thermal pad size....
The reliability life assessment of electronic packages is a key issue to ensure the mass production quality of packaging components. To meet the time-to-market and long term reliability requirements, using finite element to predict a precise life cycle of solder joints becomes the main trend of electronic packaging product development. Thermal cycling test is a standard test and has been widely used...
In this study, the effect of substrate metallization on the impact strength of Sn-Ag-Cu solder bumps, produced by a fluxless soldering process in a formic acid atmosphere, was investigated. The interfacial reaction between Sn-3.0Ag-0.5Cu solder and two different substrates (Cu and electroless nickel-immersion gold (ENIG)) during isothermal aging at 150 °C were studied. In the case of the Cu substrate,...
Despite many fatigue mechanisms published for Fan-out Wafer Level Package (FOWLP), most merely focused on stand-alone package reliability or solder joint capability. Only a few explored the failures of Chip to Board Interaction (CBI) due to the difficulty for perceiving the induced CBI failures. In this paper, a unique failure mechanism was first observed by an innovative test methodology in interconnects...
As the demand for higher resolution electronic device grows, manufacturers are seeking ways to put as much as possible pixels with using less and less space. Compare with land grid array (LGA) type packaging, WLCSP technology provide a way to shrink the package size. ShellCase WLCSP is one of the types with good reliability and small packaging size used in image sensor. But the double side glass structure...
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