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The trend towards ultra-miniaturization, high interconnection densities with minimal power consumption at low cost is driving the need for large, thin, high-stiffness substrate technologies. Glass substrates have emerged as a promising alternative to organic and silicon interposer packages due to their tunable coefficient of thermal expansion (CTE), high dimensional stability and surface smoothness,...
The relationship between TDDB characteristics of the devices having ultrathin SiO2 as gate dielectrics and the hydrogen-related trap creation have been re-investigated from the viewpoint of the oxidation process dependence. In order to study the influence of hydrogen on the reliability, deuterium isotope effect has been used. As a result, the Weibull distributions of time-to-breakdown (tBD) depends...
The growth of the Internet of Things has created a need for cost-effective and light-weight electronics on flexible substrates. Great potential lies in versatile applications of passive UHF RFID components but their robustness toward various environmental stresses must be ensured. This paper presents a comparison of thermal- and inkjet-printed passive UHF RFID tag antennas on a novel polyester-based...
Demands for higher power density and reliability on power electronics systems are driving the need for development of high-temperature packaging solutions. Existing power module packaging technologies that rely on lead-tin or lead-free die-attach solders and alumina direct-bond-copper (DBC) insulated substrates are limited to 125°C junction temperature for reliable module operation. This is because...
In this paper, a 1200-V, 150-A IGBT module was designed and fabricated using the nanosilver paste without additional pressure. Comparative tests on thermal-cycling aging were studied between the as-prepared IGBT modules and the commercial modules using high-temp solder. The results indicated that, by the thermal cycling test, the thermal resistance and on-state resistance of the as-prepared IGBT module...
Our 3D stacked CMOS image sensor (CIS) has an ideal global shutter function with 16 million pixels and 4 million micro-bump interconnections placed at a 7.6-εm pitch between two silicon substrates, achieving interconnections with very low resistance. We confirmed the reliability of our 3D stacked interconnection technology by conducting reliability tests, which included heat cycle tests and high temperature...
In this paper, we investigated the reliability test for Glass interposer. The test vehicle is assembled glass interposer with chip, BT substrate, and PCB. The structure of a glass interposer with two RDL on the front-side and one RDL on the backside had been evaluated and developed. Key technologies, including via fabrication, topside RDL formation, micro-bumping, temporary bonding, silicon and glass...
Three-dimensional integrated-circuit (3D IC) is one of the most important electronic packaging technologies nowadays. Cu-to-Cu through-silicon-via interconnection is a crucial process in 3D IC. Direct Cu-to-Cu bonding has been a challenging process for the industry due to its strict requirements on processing conditions and corresponding high processing costs. Micro-bumping is a widely used method...
Recently, there have been many developments on power devices to improve their functions. Especially, the junction temperature of power modules that equip SiC (Silicon Carbide) chips will be higher than 200 °C as current densities are too high, and new electronic packaging technologies shall be developed to meet higher temperature and higher power cycle durability requirements. In order to meet these...
The cost and the package size driven size reduction of semiconductors lead to much higher heat generation. Also the use of new high power technologies on the basis of SiC produces is a need for high conductivity of the interconnect materials. Therefore the requirements for mechanical, thermal and electrical properties of interconnect materials increase compared to existing eutectic solder and glue...
This paper presents Thick Printed Copper (TPC) as substrate technology for High Brightness LEDs, which features a strongly improved reliability combined with a significant cost advantage over incumbent technologies for High Brightness LED substrates. The advantages of TPC over Direct Bonded Copper (DBC) and Direct Plated Copper (DPC) substrates will be demonstrated by thermal shock test results and...
This paper presents Thick Printed Copper (TPC) and Celcion® as thick film technologies for a broad spectrum of industrial applications, which feature a strongly improved reliability combined with a high degree of design freedom compared to the incumbent technologies. The advantages of TPC over Direct Bonded Copper (DBC) substrates will be demonstrated by thermal shock test results and a demonstration...
Several applications require (ultra-)thin and reliable packaging of the sensor electronics. Especially the rapidly increasing use of sensor elements in nearly every field of engineering is the main driver for that fact. One specific application is magnetic field sensors in active magnetic bearings. In order to improve their precision and stiffness those bearings can be beneficially operated by measuring...
Glass provides many opportunities for advanced packaging. The most obvious advantage is given by the material properties. As an insulator, glass has low electrical loss, particularly at high frequencies. The relatively high stiffness and ability to adjust the coefficient of thermal expansion gives advantages to manage warp in glass core substrates and bonded stacks for both through glass vias (TGV)...
This paper presents embedded camera module using embedded assembly technology to meet the industry's growing needs for rearview cameras, front-view cameras, surround-view cameras, multi-lens array cameras, stereoscopic and most other automotive camera assembly and test requirements. Embedded camera module is configured by device embedded substrate with embedding passive components using embedding...
The substrate design chosen for the newer Silicon (Si) node utilizes a low core thickness compared to previous Si nodes which used a high core thickness substrate. One motivation to move to low core thickness is the better electrical performance it could provide to the package, especially since most of the newer silicon technology devices are used for high powered applications. A low core substrate...
There is a big push in the aerospace industry toward more electric aircraft (MEA)[1-2]. The progress is necessary to improve the overall power efficiency and reliability of the aircraft. Aircraft engine health monitoring (EHM) system is one the major effort from aircraft manufacturer toward MEA. This system employs arrays of strategically placed sensors that need to maintain high reliability and robustness...
System integration with high data transmission often demands packaging solution having fine line routing capability in order to deliver the desired performances with better power and signal integrity. However, while wafer fabrication is advancing at a relentless pace, IC substrate technology has not been able to catch up device's fine feature needs at reasonable cost. This is due mainly to resin materials'...
The reliability of adhesive flip chip attachments was studied. A large-area chip with a great number of contacts was attached onto a flexible polyimide substrate using anisotropic conductive adhesive film (ACF). The test samples were manufactured using various bonding forces and the reliability of the assemblies was examined using a thermal cycling test. Two temperature change rates were used in the...
Molded underfill (MUF) process for system in package with WLCSP package with cu pillar bump would be the future application in SIP module assembly due to small form factor and low cost of WLCSP and good electrical, thermal performance, fine pitch and lower cost of cu pillar bump. However, higher stiffness of cu pillar could cause interface fracture between cu pillar and solder bump during SMT process...
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