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Duo to the limitation of the gear-rack's structure profile for an aircraft slat, the maximum stress value got from test is not the value under actual load. In this paper, based on finite element model of gear-rack built by analysis software ABAQUS, the maximum stress value of gear-rack is determined by force analysis. Thus the strength of the gear-rack is checked, and finally the fatigue life is estimated...
The reliability of wing structure plays an important role in the safety of a plane. Under external loads, there may be some failures in the wing structure, including flaw, crack, wearing and so on. It is essential to make FMEA (failure mode effect analysis) for the wing structure to find and deal with the failures. In order to give some advice on optimal design of the wing structure, it is necessary...
LED lighting becomes the forth generation green lighting. However, in terms of LED development and large-scale application, the reliability of LED has become one of the technical bottlenecks. This paper carried out the research on the thermal-humidity reliability of high power LED module by the means of experiment and simulation, which mainly aims at the reliability problems existed in high power...
Irreversible extrusion of Cu from through-silicon vias (TSVs) during high-temperature processing steps presents an important potential back-end-of-line (BEOL) reliability issue. Commonly this reliability risk is mitigated by introducing an anneal after Cu plating for TSV fill. This paper presents the impact of the post-plating anneal temperature and time on residual Cu pumping during a sinter for...
Since its introduction in 1998, the quad flat no-lead (QFN) package has been used widely in semiconductor industry for various applications. In the past few years, advanced QFN packages with large body sizes (>10 mm) and multi-row bottom I/O terminals (two or more rows) have emerged as a cost & performance competitive alternative to other BGA styles packages, particularly for small form factor...
With increasing data traffic requirements to support mobile devices, tablets and computers, the need for faster internet traffic is mushrooming. The routers and switches used to drive network traffic need to deliver high bandwidth and speed. Key to achieving this high speed and bandwidth is ensuring closer integration between the Application Specific Processors (ASICs) and Memory devices. Consequently,...
Inter-layer dielectric (ILD) materials used in silicon chip backend layers tend to be mechanically fragile, and the industry trend is towards ILD materials with even lower dielectric constants and fracture toughness. Flip-chip packaging with lead-free solder materials imposes significant thermo-mechanical stresses on these fragile ILD films due to the thermal expansion miss-match between the silicon...
The work presented in this paper has been carried out in order to find means to improve the existing methods of boardlevel drop reliability assessment to better represent the use environment loading conditions of modern portable electronic devices. To provide goals and guidance for the development work, eight commercially available smart phones from different manufacturers were evaluated for their...
TSV (Through Silicon Via)-based interposer has been proposed as a multi-die package solution to meet the rapidly increasing demand in inter-component (e.g. CPU, GPU and DRAM) communication bandwidth in an electronic system. he stacked-silicon die package configuration may give rise to package reliability concerns not observed in conventional monolithic flip-chip packages. 3D finite element method...
Deformations of metal interconnects, cracks in interlayer dielectrics and passivation layers in combination with plastic packaging are still a major reliability concern for integrated circuit power semiconductors. In order to describe and understand the failure mechanism and its root cause, already a lot of work has been done in the past. However for the first time the impact of the leadframe profile...
Due to the rapidly growing MEMS initiator market and the needs for smaller, safer and higher integration, more advanced switches are in demand. The novel solid MEMS switch can improve the security and reliability of MEMS initiator, while the leads of its package are weak under high impact. This paper mainly studied the leads reliability of the novel solid MEMS switch under high impact by FEM simulation...
Currently electro-thermal simulations performed with 3D FEM simulators like ANSYS or COMSOL Multiphysics are limited to an imposed current flow through resistive materials. However, in the case of power MOS gated transistors like VDMOS transistors or IGBT, the channel resistance evolves with the gate voltage. This phenomenon is usually neglected in ON-state applications but seems to be determinant...
Consumer electronic products are evolving toward smaller size and higher efficiency. 3D IC packaging has smaller form factor and lower signal delay compared with conventional packaging. Thus, it has been widely used in mobile electronic devices. Mobile electronic device is prone to being dropped during operation. Hence, the drop reliability of electronic packaging is an important issue in 3D ICs....
This paper will focus on the fast assessment methodology of FBGA fatigue life through simulation and physics of failure (PoF) analysis under thermal cycle. The structure of fine pitch ball grid array (FBGA) that has been investigated, and been modeled by ANSYS to compare with experimental data. There are two temperature cycling will be used, one is used to verify FEA model, and the other one is used...
Ensuring reliability of interfaces of dissimilar materials is one of the most critical design aspects of electronic assemblies. A study on the interface delamination phenomenon of different power packages was undertaken. Thermally induced stresses caused by the thermal mismatch between molding compound (MC), Si-die, and Cu- heatsink act as combined shear and normal loadings on the respective interfaces...
Analysis using ANSYS software, CSP component was reduced to two-dimensional model. In the thermal cyclic loading conditions using finite element simulating the stress and strain distribution of CSP components, obtained a dangerous solder joint of structural failure. The number of failure cycles about dangerous solder joint was predicted. Finally, introduced several analysis and evaluation method for...
The recent markets crisis imposes the adoption of advanced technical solutions to match the requirements of energy efficiency, promoting a gradual transformation in the field of mechanical actuators for hazardous applications and moving the attention to more electric and efficient systems. Nevertheless the adoption of the electromechanical actuators are still limited in those fields that require a...
Deformations of metal interconnects, cracks in interlayer dielectrics and passivation layers in combination with plastic-packaging are still a major reliability concern for integrated circuit power semiconductors. In order to describe and understand the failure mechanism and its root cause, already a lot of work has been done in the past. However for the first time the impact of the edge profile of...
Copper based wire bonding technology is widely accepted by electronic packaging industry due to the world-wide cost reduction actions (compared to gold wire bond). However, the mechanical characterization of copper wire differs from the gold wire; hence the new wire bond process setting and new bond pad structure is required. It also refers to the new intermetallic compound (IMC) will form at the...
Usage of polymers materials in microelectronics and especially in packing is nowadays common. Polymer materials are used for example in case of encapsulation, underfills for flip chip, moulding compound, electrically or thermally conductive adhesive, flexible electronics, materials for Printed Circuits Board (PCB), etc. Reliability in electronic packaging depends highly on thermomechanical material...
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