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The use of copper-based dual gauge leadframe design is proven effective in the thermal, electrical, and reliability of power devices housed in a Surface Mount Devices (SMD) packages. DPAK and D2PAK packages take preference on the use of this dual gauge leadframe design, a thick leadframe diepad or heatsink thickness up to twice as thick as their leads thickness. Reducing the copper heatsink thickness...
Sensor is expected being an important component in coming IoT era. CIS CSP solution has been wildly adopted for the secondary camera in a smart phone but majority stayed in 8″ T-contact CSP in the past years. The 12″ solution is more attractive due to its low cost to drive the supply chain moving forward. The major contribution came from the gross die gain based on the analysis result. 12″ CIS CSP...
The wafer level chip scale package (WLCSP) has been widely used in mobile chipset applications since it provides a strong solution to satisfy the demands for smaller form factor, multifunctional and low cost devices. As WLCSP moves towards lower cost, higher performance and finer pitch designs to meet the increasing requirements of electronic products, there are a number of challenges in preventing...
In this paper, the author has shown that the board-to-board connector with narrow pin pitch is subject to external force resulting from 3D finite element method analysis.
Resistive random access memory (RRAM) has been recognized as one of the most promising candidates for next generation non-volatile memory due to its simple structure and excellent scalability. However, poor reliability is a serious issue for RRAM memory applications. To improve the reliability and endurance, many researchers changed the cell material, process and structure. Here, in this paper, we...
A first error analysis for finite element solutions of time-harmonic boundary value problems involving cylinders moving in the axial direction is carried out. It is shown that the solutions are affected by errors which behave in a very regular way, as it happens with traditional problems and finite element simulators in the presence of motionless objects. The effects of the motion on the errors considered...
The present paper describes how fault-tolerance concepts are implemented in electrical drives for high reliability applications, such as in the More Electric Aircraft.
Automobile anti-theft system need to use Multi-sensor data fusion. For the problems in the process of multi-sensor data fusion, D-S evidence theory based on the weight distribution is corrected using the theory of matrix analysis. After verification, the algorithm can deal with the integration process operation problem of excessive very well. In the case of failure of one or more sensors this algorithm...
As extremely important insulation support, insulators play a significant role in the transmission lines construction project. That the type of insulators varies with the environment condition can control the corridor width effectively. For now insulators of the II-type and the V-type are common used in the in-service transmission lines. By using the Y-type insulator, the corridor width of transmission...
The knowledge of a historical masonry building is a prerequisite both for the purposes of a reliable evaluation of the actual seismic safety and for the choice of an effective intervention for the preservation of the monumental building. It is therefore a need to refine the investigations and techniques of analysis by different degree of reliability, as well as in relation to their impact. Knowledge...
Although coils for Inductive Power Transfer (IPT) works on the fundamental principle of Ampere's and Faraday's laws, on which conventional transformers work, there is difference in approach required for designing coils for IPT than designing a conventional transformer. Because of the complex design of some IPT coils and the increasing emphasis on the magnetic field strength of such systems, Finite...
Deformations of metal interconnects, cracks in interlayer dielectrics and passivation layers in combination with plastic packaging are still a major reliability concern for integrated circuit power semiconductors. In order to describe and understand the failure mechanism and its root cause, already a lot of work has been done in the past. However for the first time it is demonstrated that stress induced...
Cu pumping is a potential reliability issue for through silicon via (TSV) based 2.5D and 3D integration, due to the CTE mismatch between silicon and copper. In this paper, we report the reliability assessment of Cu pumping treated at different annealing conditions. Cu pumping is simulated by finite element method to compare the effect of the overburden layer. The pumping of TSVs having a diameter...
In order to understand the state of process induced stresses in air-gap interconnect structures fabricated by means of etch-back procedure, finite element (FE) models of a 90nm pitch interconnect were developed and stress analysis of the structure was conducted as a function of the dielectric liner and metal barrier (MB) thicknesses in a parametric study in order to minimize the risk of mechanical...
To denote an exact form of decoupling software modules in object-oriented programming the dependency inversion principle is used. By using this principle, the conventional dependency relationships known from high-level, policy-setting modules to low-level, dependency modules are reversed which results in description high-level modules autonomous of the low-level module implementation details. In conventional...
Solder joints are commonly used in the electronic packaging industry to provide electrical connection and serve as the mechanical support between a package and a printed circuit board (PCB). A coefficient of thermal expansion mismatch between component and board generates thermally induced strains in solder joints because of environmental temperature change, which ultimately causes fatigue failure...
As Low-K materials become a primary development emphasis and are used at advanced technologies in sem iconductor industry, it is observed that chip crack and delamination are the commonly seen failure which may lead to rel iability failure. This paper introduces a general test structure and test methodology for mechanical integrity in CPI (Chip Package Interaction) reliability qualification. To improve...
In order to study the reliability of oil derrick changing with load, section size and other factors, this paper analyzes the random reliability of oil derrick by using ANSYS finite element probability design system. Using the Monte Carlo method, the elastic modulus, section size and other random variables are simplified as Gaussian distribution function, the load distribution is simplified as logarithmic...
Mechanical stress induced by mechanical and thermal loading on thin silicon devices breaks the devices at a certain load called the fracture or breaking strength of the device. The displacement experienced by the dies, due to bending, at fracture strength is called the fracture displacement. The strength properties of thin, bare silicon dies have already been reported. This work extends the study...
Vacuum Breakers are now being increasingly utilized at transmission class voltages. The vacuum interrupters in these breakers require considerably longer strokes i.e. open gaps as compared to those in medium voltages. Also the closing and opening speeds are higher. This requirement of longer strokes and higher velocity calls for a special design of bellows and the end components of the vacuum interrupters...
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