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Gold (Au) nanoelectrode ensembles (NEEs) were investigated after the synthesis of silicon nanowires using the metal assisted chemical etching technique. Structural and non-destructive optical characterization of silicon nanowires are carried out to determine its morphology and crystallinity. The cyclic voltammetry technique is used to determine the oxidation-reduction potentials of the sensor at different...
We designed a novel needle-encapsulated wire-electrode for a brain-machine interface. A thin wire-electrode was embedded into a biodegradable microneedle to ensure stiffness during insertion into brain tissues. A fabricated needle-encapsulated wire-electrode was inserted into agar media as part of a proof of concept experiment. The biodegradable microneedle structure itself gradually dissolved in...
We report the successful implementation of a modified SOI-on-Glass fabrication process that greatly facilitates realization of stress-free MEMS structures suspended over small gaps, especially useful for capacitive transduction. The key modification is in patterning the capacitive gap in the SOI and patterning the structural layer before bonding the SOI to glass wafer. We demonstrate the process by...
Functionalized engineered nanogap electrodes (pair of electrodes separated by a gap of a few nanometers) are utilized as tunneling chemoresistors for gas sensing and resistance switching at the molecular scale. The nanogap device consists of two gold electrodes vertically separated by a very thin spacer of 2 nm of α-Si and ∼4 nm of dielectric (SiO2 or Al2O3). A ∼10 nm wide sidewall air gap is formed...
Nowadays, electronic circuits based on wide range of organic materials with semiconductor properties are still perceived as a somewhat unconventional design approach and fabrication technology. However, it could potentially deliver many significant advantages. Materials for organic electronics are typically lighter, flexible, easier to handle and less expensive in comparison with traditional inorganic...
We describe the microstructuring of a silicon surface to act as a spatially tunable dielectric layer. As an example, we show FDTD simulations and fabrication results of it used as an antireflective layer optimized for the terahertz region.
Over the past ten years, several silicon microfabrication techniques have emerged to fabricate components for THz instruments. Our approach focuses on the use of multiple silicon dioxide (SiO2) masks and consecutive silicon etching steps using deep reactive ion etching (DRIE) to create multi-step devices with very fine features. We are reporting here on the fabrication of hydrid couplers and a turnstile...
As CMOS device scaling approaches to sub 10-nm node, quantum size effects become significant even at room temperature. Recent progress in the fabrication technology of silicon nanostructures has made possible observations of novel electrical and optical properties of silicon quantum dots, such as single electron tunneling, ballistic transport, visible photoluminescence and electron emission. Possible...
The rapid progress in semiconductor fabrication technology has realized such a high-integration that allows us to implement enormous number of transistors for higher performance and/or higher on-chip functions in both memory area and microprocessor area. For ASIC (Application Specific IC) devices, the high integration density is attractive because it brings more advanced features into a single chip.
A fabrication-tolerant polarization beam splitter (PBS) based on grating-assisted contradirectional couplers is experimentally demonstrated. Over 30-dB extinction ratios are achieved for both polarizations. Large fabrication tolerance in coupling length is also verified.
CMOS-compatibly fabricated silicon athermal MZI is trimmed in wavelength by the amount from −0.15 to −5.15 nm using thermal annealing process over 400 °C. Temperature-dependence less than 2 pm/°C is maintained after the annealing.
The PVD-TiN metal-gate SOI-CMOS integrated circuits including inverters and ring oscillators have successfully been fabricated on a half-inch (100)-oriented SOI wafer using the minimal-fab and mega-fab hybrid process, and their electrical characteristics have systematically been investigated. It was experimentally found that almost an ideal subthreshold slope (SS) of 67 mV/decade and an extremely...
This work reports on metal assisted chemical etching (MACE) for high aspect silicon structures. Ultra-high aspect trenches and pillars of 400 and 80, respectively, have been achieved by MACE. Additionally, a cantilever fabrication based on above pillars is demonstrated by using assembly technology. The pillars are assembled onto glass substrate and fixed by conductive glue. The fabricated cantilever...
Undercut design in a highly-stressed microdisk resonator cavity affects the magnitude and distribution of biaxial strain in the resonator, providing an additional approach to band-structure engineering. While a wider undercut allows greater strain transfer, the peak strain shifts away from microdisk edges where whispering gallery modes reside. With both considerations, we find that the optimal undercut...
We presented a comparison and analysis on single-layer silicon fiber-to-chip edge couplers with different taper tips. The double-tip edge coupler exhibits a lower coupling loss, larger bandwidth and better fabrication tolerance. In addition, the short edge couplers with 40 μm length have the best performances.
Glass is one of the essential materials for optical devices due to its transparency. It usually loses about 4% of energy of an incident light at its interface. In order to suppress its reflection, moth-eye structure, which is the nanoscale tapered pillar array, has a remarkable anti-reflection performance. In its fabrication method, nanoimprint lithography has been paid attention due to the availability...
In this work, we present the design and fabrication of high-frequency SiC nanoresonators for highly sensitive nanoparticle sensing. A 280-nm single crystalline SiC film was grown on a Si wafer, and released from the substrate using an isotropic dry etching process. The SiC nanoresonators were then formed using the Focused Ion Beam technique. The simulation results show that the as-fabricated resonators...
Mode characteristics are investigated to realize stable unidirectional emission for a locally deformed-ring resonator. Using DVS-BCB bonding technique, hybrid silicon deformed-ring microlasers are fabricated coupled to a silicon waveguide, and threshold current of 7 mA and unidirectional power output from CCW direction are obtained.
I will report some of our recent developments in engineering and manipulating light-matter interactions, via the artificially constructed metamaterials of ultrathin thickness compared to the wavelength. In particular, the low-dimension and high-frequency scaling may promise a lot more interesting applications, while the challenges in design principle and fabrication capability will become critical...
This paper describes an application of DSP for space vector modulation technique which in turn implemented to the three phase voltage source inverter. Use of this technique provides efficient use of the DC voltage fed to the inverteras compared to other techniques. The said system is designed and developed for brushless DC motor (BLDC). dsPIC 30F3011 is used to implement the control algorithm. The...
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