The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
With the anticipated slow-down of Moore's Law in the near future, three-dimensional (3D) packaging of microelectronic structures would enable to further increase the integration density required to meet the forecasted demands of future exa-scale computing, cloud computing, big data systems, cognitive computing, mobile communicatoin and other emerging technologies. Through-silicon vias (TSVs) are a...
The interconnection of silicon solar cells is commonly realized by soldering copper ribbons or wires with a solder coating onto screen-printed silver contacts. Due to the difference of the coefficient of thermal expansion (CTE) of copper and silicon, thermomechanical stress is induced after the soldering process during cooling down to room temperature. In the first part of this work, a model is introduced...
Cognitive radio networks (CRNs) enable cognitive users (CUs equipped with spectrum sensing) access the underutilized spectrum licensed to primary users (PUs) without causing unacceptable interference to the PUs' activities. On appearance of PUs, the available channel of CUs at different position may have different available channels which changes dynamically over time. Due to temporal and spatial...
With the growing demand for mechanically flexible electrical systems and the increasing level of integration of electrical assemblies, hybrid build-ups combining polymer substrates and ultra-thin flexible silicon chips (system-in-foil) are getting more and more important. These systems need thin chips which maintain their functionality even in bent condition as well as reliable handling and assembly...
Hybrid System in Foil (HySiF) technology has the potential to combine compact high-performance circuit integration on thin, flexible silicon chips with thin-film large-area components jointly on a polymer foil substrate. In this manuscript, such a HySiF technology demonstrator known as "Smart Skin" is presented. It contains bending stress sensors along with other modular technology components,...
As electronic product becomes smaller and lighter with an increasing number of function, the demand for high density and high integration becomes stronger. Interposers for system in package will became more and more important for advanced electronic systems. Silicon interposers with through silicon vias (TSV) and back end of line (BEOL) wiring offer compelling benefits for 2.5D and 3D system integration;...
The demand for high performance systems is rising. Whether to look at the high resolution and color depth requirements of upcoming display generations, high bandwidth network communication, or at high performance computing in general, to need to transfer data as fast as possible inside a system is crucial. A crucial aspect is the memory/processor interface, which faces multiple challenges such as...
We report an another unconventional growth of dense network Single Wall Carbon Nanotube (SCNTs) and Highly aligned Carbon Nanotubes using Cu(NO3)2 and CuO as catalyst. A systematic study for effects of oxygen on catalytic quality of Copper and on CNTs growth also studied. All reactions are performed in atmospheric pressure in thermal CVD chamber. The CNTs are characterized using HRSEM and micro-Raman...
The purpose of this research is to confirm that domestic database, in the case of J-GLOBAL, will be able to be used for strategies of science and technology in the same way as global database, such as Web of Science. Domestic databases have potentials to provide unique cutting edges, due to the custom of presenting it in local conferences before publishing it in global academic journal. In addition,...
In this paper, we present an innovative solution to successfully metallize Through Silicon Vias (TSV) with High Aspect Ratio (10:1). These structures represent a key element in the 3D mid-process integration approach. The metallization consists in depositing, respectively, a diffusion barrier and a seed layer, using two different conformal deposition techniques. The technique used for the barrier...
A copper-aluminium alloy (90:10wt%) has been investigated as a possible candidate for future interconnect applications. The tendency of the Al to segregate at the surface of the Cu following thermal anneal makes this alloy potentially suitable to function as a self-forming Cu diffusion barrier layer. X-ray photoelectron spectroscopy (XPS) and electrical characterisation measurements were used to study...
Promoted by the component miniaturization trend, three-dimensional integration appears as a promising option for implementation of the next generation of integrated circuits. In this context, copper is still an interesting material to be integrated to vertical interconnexion through direct metal-metal bonding processes. However, it was already reported that voiding phenomena occur in bonded copper...
3D integration requires vertical stacking of dies while forming permanent electrical and mechanical connections between the input/output pins of the devices. Through silicon via (TSV) is one of the key elements for 3D integration. This paper presents different liner and barrier/seed approaches for realizing 10×100 um void-free copper filled TSVs. Mechanical and electrical performances of these liner...
Silver sintering is a promising emerging microelectronic assembly technology. In this paper sintered silver attachment joints of silicon dies have been studied. It has been pointed out that in pressureless process conditions porosity can disappear of some zones of silver sintered attachment joints. The link between densified zones and the thermo-mechanical stress has been demonstrated. Densified zones...
A three-dimensional system-in-package (3-D SiP) based on silicon carriers or an interposer is a fast-emerging technology that offers system design flexibility and the integration of heterogeneous technologies. A passive interposer, which is a way to bridge the feature gap between the integrated circuit (IC) and the package substrate, is a key building block for high performance 3-D systems. The need...
Silicon interposer has emerged as a substrate of choice for integrating fine pitch, high density devices. Conventional packaging of 2.5D/3D devices involves multiple level of assemblies. Normally, 2.5D/3D devices are first assembled on thinned silicon interposer with aspect ratio of 10:100 followed by second level assembly on a multi-layer organic build-up substrate. In this study we introduce direct...
We report a novel ultrafast burst mode fiber laser system, which can deliver pulses at ultra-high repetition rates in order to systematically investigate micromachining efficiency on copper and silicon samples.
The thermal stress of the voltage standard chip soldered on a copper or sapphire substrate was numerically analyzed by a finite element method. It was confirmed that the thermal stress in the chip soldered on the sapphire substrate is much smaller than that in the chip soldered on the copper substrate. Since the magnitude of the thermal stress applied to the chip depended on the thickness of the substrate,...
A new approach based on the development of a new low-cost masking material and a new technique for performing fast wet processes (i.e. chemical etching and electroplating processes) are presented, back side silver removal is proposed allowing in combination with a multi-bus bar module assembly technique to boost standard silicon solar cells towards higher efficiencies at low cost. The new masking...
This paper reports on an investigation into the use of laser ablation inductively-coupled plasma mass spectrometry (LA-ICPMS) in analyzing copper diffusion through nickel barrier layers in selective-emitter silicon solar cells. Cells plated with nickel and copper were heat-treated at 200 °C for up to 15 hours. Following quenching in ethylene glycol, significant degradation was observed in the plated...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.