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Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. Mold embedding for this technology is currently done on wafer level up to 12”/300 mm size. For higher productivity and therewith lower costs larger mold embedding form factors are forecasted for the near future. Following the wafer level approach then the next step will be a reconfigured wafer size of...
Taiwanese memory packaging and testing factories include Powertech, ChipMOS, ASE, SPIL, Walton and FATC. The global three first tier giants, Samsung Electronics, Hynix and Micron, have predicted that the DRAM market in 2014 will be more stable. With the three-giant monopolization taking shape, the strategic alliance and corresponding excess profits of back-end packaging factories are expected to be...
A typical 3D-BGA packaging model was set up and numerical simulation method was used to study its thermal field and thermal stress field distribution when chip works on a given power. Different heat convection coefficients and packaging materials had been applied to study their effects on the temperature and stress field. The results show that the influence on the temperature and stress field decreases...
MSLA, the abbreviation of Moisture Sensitivity Level Analysis, is the meaning of moisture sensitivity level analysis. MSLA is to give the proposed package moisture sensitivity of surface mount components provide a standard of classification, so that different types of components to get the correct packaging, storage and handling to avoid moisture resulted failures in the assembly or repair process...
Polymer based organic photovoltaic systems, which can be mass-produced by roll-to-roll printing technology, hold the promise for a cost-effective, lightweight and mechanical flexible solar energy conversion platform. Nevertheless, challenges still remain for large-scale applications of these flexible solar cells. One of the issues of great importance is the long-time reliability of solar cell module...
Modern economic activities rely on logistics to support the flow of goods, but the logistics activities consume a lot of resources, and cause much pollution. Green logistics is therefore an inevitable trend in the development of the logistics industry and can even minimize the logistic costs. One of the top Taiwan manufacturers of TFT-LCD panels in the world with a market share of 15.2% in large-sized...
CMOS chips are increasingly used for direct sensing and interfacing with fluidic and biological systems. CMOS circuits for sample acquisition, signal processing, and readout have been integrated with various sensors to form complex biosystems-on-chip. However, distinct and vexing technical challenges arise from the disparate requirements of biosensors and integrated circuits. From the perspective...
Packaging of microelectromechanical systems (MEMS) strongly affects the device performances. It is the core technology for the advancement of MEMS and is recognized as the next manufacturers challenge for the forthcoming years due to the growing market and stricter requirements. There is a vast diversity of applications and the most of MEMS packaging challenges are application dependent. It is the...
MSLA, the abbreviation of Moisture Sensitivity Level Analysis, is the meaning of moisture sensitivity level analysis. MSLA is to give the proposed package moisture sensitivity of surface mount components provide a standard of classification, so that different types of components to get the correct packaging, storage and handling to avoid moisture resulted failures in the assembly or repair process...
A typical 3D-BGA packaging model was set up and numerical simulation method was used to study its thermal field and thermal stress field distribution when chip works on a given power. Different heat convection coefficients and packaging materials had been applied to study their effects on the temperature and stress field. The results show that the influence on the temperature and stress field decreases...
Polymer based organic photovoltaic systems, which can be mass-produced by roll-to-roll printing technology, hold the promise for a cost-effective, lightweight and mechanical flexible solar energy conversion platform. Nevertheless, challenges still remain for large-scale applications of these flexible solar cells. One of the issues of great importance is the long-time reliability of solar cell module...
Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. Mold embedding for this technology is currently done on wafer level up to 12"/300 mm size. For higher productivity and therewith lower costs larger mold embedding form factors are forecasted for the near future. Following the wafer level approach then the next step will be a reconfigured wafer diameter...
Semiconductor industry, for more than four decades, has rigorously followed Moore's Law in scaling down the CMOS technologies. Three-dimensional (3D) technology using Through Silicon Via (TSV) interconnect is one of the emerging options, considered today as a new paradigm for the semiconductor industry, since it will drive evolution for packages for the coming decades. The industry has enthusiastically...
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