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This paper deals with the idea of developing new philosophies for the reliability assessment of additive layer manufacturing (ALM) parts. ALM is a disruptive new manufacturing method by which components are created adding material layer after layer, allowing for the design and production of complex geometries, unthinkable with the use of traditional subtractive machining methods. Thinking ALM means...
In order to enhance the reliability of a flip-chip on organic board package, underfill is usually used to redistribute the thermo-mechanical stress created by the Coefficient of Thermal Expansion (CTE) mismatch between the silicon chip and organic substrate. However, the conventional underfill relies on the capillary flow of the underfill material and has many disadvantages. In order to overcome these...
Photovoltaic (PV) module degradation in the field is a known issue; however, understanding the modes and mechanisms in which modules degrade is still a major undertaking for researchers. To understand the degradation modes and mechanisms, both nondestructive and destructive characterization techniques need to be employed. This paper presents the results and conclusions obtained based on a few major...
Photovoltaic backsheets are an essential part of photovoltaic modules. It is imperative that the backsheet perform and be shown to be weatherable over the 25 year expected module lifetime. This paper reports on findings from a study focused on understanding the durability of the outer weatherable layers of commercial backsheets exposed in south Florida. Within one year of exposure, Non-Fluoropolymer...
In 3D-IC packages, the Si-to-Si stacking is joint by u-bump which has fine gap structure and high bump count. Because of the high density structure, the flux clean process face challenges. So, non-clean flux is another alternative. However, the flux residue can cause reliability issue such as UF delamination, corrosive relation, electro-migration due to the residue from flux. To reduce the flux residue...
Many studies have widely accepted the assumption that learning processes can be promoted when teaching styles and learning styles are well matched. In this study, the synergy between learning styles, learning patterns, and gender as a selected demographic feature and learners' performance were quantitatively investigated in a blended learning setting. This environment adopts a traditional teaching...
One of the most important issues in technology management at manufacturing companies is to realize “process innovations” that will improve current activities and business processes in order to produce high-quality, low-cost products, systems, infrastructures and services with a short lead time by fully utilizing manufacturing technologies. Design for manufacturability (DFM) is one of the effective...
Finland and Baltic States initiated Distribution Cert project realization, based on multifunctional professional educational system of Finland. Projects provide opportunities to harmonize Baltic vocational training (VET) systems with EU requirements and best Nordic practices. There is a practical working example of mutually beneficial collaboration between policymakers, employers and training service...
Crowdsourcing can be a cost-effective method for tackling the problem of digitizing historical bio collections data, and a number of crowd sourcing platforms have been developed to facilitate interaction with the public and to design simple "Human Intelligence Tasks". However, the problem of reaching consensus on the response of the crowd is still challenging for tasks for which a simple...
Students' goal orientations impact their self-regulation, engagement, and achievement in post-secondary STEM courses. But, how students' goal orientations change across a semester and the impacts of these changes have not been extensively studied. Study purposes were to investigate goal orientation change across the semester, associations of goal change with achievement and self-regulation, and associations...
In this paper, a new subjective assessment system for video quality is proposed to acquire accurate assessment result, which consists of three assessment methods. In addition, a combined screening strategy is presented to ensure the final result's reliability. The reliability of the assessment result proved to be promoted after introducing multiple methods of assessment and screening strategies.
This paper focuses on development of a low contact resistance interconnection for low temperature bonding applications. Alternative to conventional display interconnection mechanisms using anisotropic conductive film (ACF), solder and underfill method using low melting point Bi58-Sn solder is suggested. Solder bumping is carried out using a maskless Solder-on-Pad technology. An average bump height...
In this study the bending reliability of an isotropic conductive adhesive (ICA) filled between two printed circuit foils (PCF) as interconnection for a System-in-Foil is evaluated. The filling is realized by a Jet-Dispense process on oxygen plasma treated, as well as non-plasma treated foils. The samples are tested on a bending test setup capable of real-time electrical measurements during bending...
The main trends in consumer electronics are increasing product performances and costs reduction. These trends lead to an ongoing integration on package level which leads to a decreasing size of the solder contacts. This goes along with a higher sensibility to thermal-mechanical stress and the immanent void formation due to electromigration (EM) effects in interfaces and bulk materials like solder...
Within the last years a constant increase of application temperatures for electronic packaging is observable, this is true for sensor applications, for power electronics packages and also for Smart Power Modules, integrating control logic and power ICs in one compact package. Drivers for HT use are on the one hand the introduction of GaN/SiC power electronic devices; these need modules to operate...
The electronics packaging in microsystems technology for medical applications includes various tasks. The interdisciplinary approach is the most important basis for the success of a product. For the reliable operation of medical microsystems different factors must be considered. The functionalization of a catheter depends on different influence factors. The form factor takes the most important role...
Radio frequency identification (RFID) tags are typically used for object identification in environments in which they are not exposed to very harsh conditions. However, there is an increasing demand for inexpensive RFID tags for use in harsh industrial environments, but the adequate performance of the materials used in them needs to be verified in such conditions. This paper reports the reliability...
Solder joint crack in thermal cycling on board (TCoB) for surface mount devices (SMD) is becoming more stringent in semiconductor market. Current TCoB literature mainly focuses on Finite Element Analysis simulation with ANSYS software to identify the most sensitive parameters affecting TCoB performance and estimating the solder fatigue life. By a given Driver Mosfet Power QFN, this paper is focusing...
Under the new technical condition, the promotion of equipment complexity and high-tech features makes a significant increase in the workload of equipment support. Commands of support organizations become more complex. In order to meet these demands, the equipment support system has gradually evolved to the network structure. Network-centric equipment support system will become the development trend...
Silver-based low temperature sintering technology (LTST) is becoming a promising alternative to bond or joint the large area joints as die attach for high temperature power modules. A review of the silver-sintered die attach technologies will be presented in this paper, as well as a roadmap of challenge of the state-of-the-art silver sintering. Then, highlighted are the methodology of sintering process,...
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