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The degradation mechanism of 808 nm GaAs-based high-power laser diode bars (LDBs) which has 47 single laser diodes is investigated using infrared thermography, focused ion beam, high-resolution transmission electron microscopy, and energy-dispersive X-ray spectroscopy techniques. We obtained the temperature distribution of the output facet and the results indicate that emitter 24, which is located...
The capability to ensure reliability while operating in extreme environments is important for the most demanding automotive applications. Even though pressure sensors are a well-established area in the MEMS industry, improvements in sensor design are needed to deliver reliability and long operational life. This paper reports the design, fabrication and testing of a harsh media backside absolute piezoresistive...
Gallium Nitride (GaN) based power devices have been demonstrated to deliver higher energy efficiency than their Silicon (Si) counterparts for 200–1.2kV rated applications. The benefits of GaN technologies and their market potential will be highlighted in this paper together with the main challenges that GaN-based power systems need to overcome to reach their full potential and finally enter the market...
Safety Instrumented Systems (SIS) act as important safety barriers in industrial systems for preventing hazardous accidents. It is therefore significant to study the reliability issues of SIS. As a matter of fact, SIS have common behaviors such as periodic test policies to discover dangerous undetected failures. Modeling patterns capitalize the experience from modeling SIS. By reusing modeling patterns,...
Silicon carbide (SiC) devices have its unique advantages of high operating temperature, high voltage capability with low switching losses when compared to its silicon counterparts. This paper presents a systematic method for long-term reliability analysis for SiC devices. The reliability block diagrams (RBDs) have been established for a SiC power module with standard wire-bonded package. The reliability...
This paper considers a relayed broadcast in IEEE 802.11 wireless local area (WLAN) networks. In the relayed broadcast, a source node intends to deliver data frames to many nodes beyond its coverage and all the nodes except the source node attempt to relay the received data frames in a contention-based and distributed manner. This traffic dissemination scheme, referred to as flooding, has several problems...
In this paper, a hierarchical motion estimation (ME) algorithm is proposed for motion-compensated frame interpolation. The algorithm estimates the true motion vector field (MVF) of a video frame from its candidate MVFs, which are the results of full-search block-matching that utilizes multiple block sizes, by maximizing the posterior probability for the true MVF. Owing to probabilistic models utilized...
In cloud environments, trust is necessary because services have the characteristics of uncertainty, dynamic, false or fraudulent which usually make users difficult to obtain desired services. In this paper, we consider trust-oriented workflow scheduling with temporal constraints including service setup times and workflow deadlines. The considered problem is mathematically modeled. A behavior-based...
In this paper, key aspects of silicon-carbide (SiC)-based automotive traction drives are reviewed. Firstly, the required supporting factors to achieve optimal operating conditions and best performance are described. Major component sizing methodologies and constraints are included. Expectations on gate threshold voltage, trans-conductance, and transient oscillation are discussed. Tolerance against...
Electrical equipment reliability model and maintaining equipment set choice are the fundamental of power system risk evaluation. Based on the online monitoring, electrical equipment reliability model is more and more detailed and accurate. However, the research about the maintaining equipment set choice is rough. At present, the decision about the maintaining equipment set choice is converted into...
Silicon Carbide (SiC) diodes are already commercially available since 15 years and have gained significant market share in power supply and solar converter applications. In the last few years, the SiC device family was enriched by switches. They become increasingly more important for differentiation of power converters in size, weight and/or efficiency. The dedicated material properties of SiC enable...
This paper presents Thales main results for the maturity development activities of TopAxyz MEMS Vibrating Beam Accelerometer (VBA) using a differential resonator architecture implemented on a planar SOI silicon layer. Proof of concept with Navigation grade performances level has already been presented at ISS2012. Development focused on two major challenges: to reach a high production yield and to...
For comparing the stability and reliability of horizontal, vertical and flip LED chips, we carried on the high temperature and high current aging experiment towards to the three kinds of bare LED chips on our self-build online monitoring and accelerated life system. Most of samples shown stable performance during the entire experiment process, but there was only one flip LED chip whose illuminant,...
As the demand of power converter for higher power density is increasing, bonding wire failure of IGBT module becomes more severe. Accordingly, it is of great significance to investigate the reliability of bonding wire under operating condition for improving the reliability of IGBT module. In this paper, the finite element model of IGBT module was established, and a two-step indirect coupling electro-thermal-mechanical...
Three-dimensional (3D) package technology is currently considered as one of the best solution to beyond Moore's Law and achieve miniaturization, high density and multi-functional of the device. Copper filled in through silicon via (Cu-TSV) technology with good electrical performance and high reliability, is a new type of 3D packaging technology. Cu-TSV has been widely used in integrated circuit technology...
A novel lead-free solder alloy 90.6Sn3.2Ag0.7Cu5.5Sb, designated as Indalloy276, was developed targeting for high reliability with a wide service temperature capability. The alloy exhibited a melting temperature range of 223 to 232°C, reflowable at profile with peak temperature 245°C and 255C, with ambient temperature Yield stress 60MPa, UTS 77 MPa, and ductility 28%, and a higher stress than both...
Thermal wind sensor has been used to measure wind speed and direction in high temperature due to its principle. In this paper, a novel structure is proposed. It consists of a silicon sensing substrate and a ceramic chip for packaging, in which the sensing chip with through silicon vias (TSV) is Cu-Sn eutectic bonded to the ceramic. This paper focuses on the thermal-mechanical reliability of the novel...
The US Navy's recent reduction of the dc bus voltage for the new surface combatant, from the original 20 kV to the new target of 12 kV, opens up the design space to a broader range of options than was possible to date. This paper is an attempt to address the opportunities and risks associated with the adoption of multi-level topologies and Silicon-Carbide switches in the design of power converters...
Grain characteristics of copper filler have an important influence on physical properties of through silicon vias (TSVs) in three-dimensional (3D) packaging. Due to the mismatch of coefficients of thermal expansion (CTE) between the copper and silicon, there exist obvious thermal stresses when the TSV structure is bearing thermal load. However, the elastic response characteristics of copper can be...
This study combines finite element (FE) modeling and digital signal processing (DSP) to predict the fatigue life of a ball grid array (BGA) package mounted on the print circuit board (PCB) under a random vibration loading. First, the board-level assembly was modeled using ABAQUS. Then the modal analysis and a following power spectrum analysis were performed to calculate the power spectral density...
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