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This paper designed a 1-Mb HfOx-based embedded Resistive Random Access Memory (RRAM) device with a one-transistor-one-resistor (1T1R) structure, and systematically investigated its working temperature range. It noted that this embedded RRAM macro has a 1.6X working temperature range than previous design for some extreme environment. Using the peripheral-assisted technique, it can enable the error...
Reliability testing has become extremely important in modern electronics as the soft error rate has been increasing due to technology scaling. The testing must be controllable, generic, done before deployment, cheap, and fast. Even though fault injection is often the most appropriate solution considering these requirements, it is very time-consuming. This work proposes a hybrid fault injection framework...
To analysis the reliability of the permanent magnetic actuator, the life test of permanent magnetic actuator is carried out and the related parameters are measured. Traditional reliability evaluations are generally based on the failure life data. Due to the small samples of the life test, the performance degradation method is applied in this paper. By analyzing the degradation path of the related...
Dc electric railway is one of the important application fields of low voltage dc power supply. The reliability analysis of each component in dc power supply system in East Japan Railway Company whose voltage level is dc 1.5kV was carried out. Such quantitative analysis can realize reasonable proposal of redundant dc circuit configuration. In this paper, the relation between the redundant configuration...
PUFs are an emerging security primitive that offers a lightweight security alternative to highly constrained devices like RFIDs. PUFs used in authentication protocols however suffer from unreliable outputs. This hinders their scaling, which is necessary for increased security, and makes them also problematic to use with cryptographic functions. We introduce a new Dual Arbiter PUF design that reveals...
This paper explores the feasibility, in terms of performance and reliability, of gain-cell embedded DRAM (eDRAM) to be operative at sub-threshold range, when they are implemented with 10nm FinFET devices. The use of individual transistor resizing in order to achieve better cell performance (i.e. retention time, access time, and energy consumption) at the sub-VT operating level is studied. In this...
This work aims at the study and analysis of the influence of coordination and selectivity of protection devices on the reliability of electricity distribution networks. A methodology will be present for the implementation of a computational system that has as main points the integrated analysis of short circuits, coordination and selectivity of protection devices and calculations of reliability indicators...
Hot carrier reliability imposes challenges in the design of STI-based laterally diffused metal-oxide-semiconductor (LDMOS) devices as the device feature is miniaturized. Efforts to quantify the degradation are crucial in countering the device reliability risk. This paper investigates the effect of shallow trench isolation (STI) angle on hot carrier effect (HCI) of STI-based LDMOS devices. The effect...
SRAM-Based FPGAs represent a low-cost alternative to ASIC device thanks to their high performance and design flexibility. In particular, for aerospace and avionics application fields, SRAM-based FPGAs are increasingly adopted for their configurability features making them a viable solution for long-time applications. However, these fields are characterized by a radiation environment that makes the...
In this paper, we propose Joint Latch (JLatch) and Joint Flip-Flop (JFF), two novel reconfigurable structures which bring the reconfigurability of reliability to user latches and flip-flops (FFs) in reconfigurable devices such as FPGAs. Specifically, we implement two reconfigurable storage elements that exploit a trade-off between reliability and amount of available resources. In fault prone conditions,...
SRAM-based Weak PUFs have become popular in tamper sensitive key storage and device ID generation. Weak PUFs rely on intrinsic process variations to produce repeatable and unique start-up behavior. However, noise in the system compromises repeatability of SRAM start-up behavior. To obviate this problem, a number of solutions such as fuzzy extraction and error correcting codes have been proposed to...
Spin-Transfer Torque Magnetic Random Access Memory (STT-MRAM) has been explored as a post-CMOS technology for embedded and data storage applications seeking non-volatility, near-zero standby energy, and high density. Towards attaining these objectives for practical implementations, various techniques to mitigate the specific reliability challenges associated with STT-MRAM elements are surveyed, classified,...
Physical Unclonable Functions are promising candidates for lightweight authentication applications as they are hard to predict and clone. PUFs are dependent on process variations that occurs during silicon chip fabrication. As the CMOS technology scales down towards nanoscale dimensions, there are increasing transistor reliability challenges which impact the lifetime of integrated circuits. These...
SAC305 solder paste is commonly used electronic assembly. This solder alloy consists of 96.5% tin, 3% silver, and 0.5% copper and melts at 219 °C. The peak reflow temperature range is typically 240 - 260 °C. With electronic devices such as smartphones, notebook PCs, and tablets becoming thinner, packaging substrates, such as ultra-thin flip chip ball grid arrays (FCBAs), and the printed circuit boards...
Self-heating in AlGaN/GaN high electron mobility transistors (HEMT) degrades device performance and reliability. Under nominal operating conditions, a so-called hot spot develops near the drain-side edge of the gate. The magnitude of the peak temperature at this local hot spot directly impacts device lifetime. Especially, such self-heating effects are aggravated in AlGaN/GaN HEMTs employing low cost...
In the world practice of designing highly reliable systems and ensuring the reliability of their operation in the process of operation is achieved through the use of specialized software complexes to determine the reliability of complex technical systems that perform the calculation of the aggregate reliability characteristics, and as a particular, simplest case, quantitative. For educational purposes,...
In this article, authors developed a model for one particular example of microgrid and considered possibilities to integrate solar panels and power storage into existing grid with diesel generator. The choice of configuration is described and power Quasi-Dynamic simulations are performed for the verification of the model. This paper mainly focuses on reliability issues and considers probability of...
In recent years, SRAM-based and other Weak PUFs have found applications in tamper sensitive key storage and ID generation. SRAM-based PUFs, for example, rely on intrinsic process variations to enable repeatable and unique start-up behavior of their outputs. However, noise in the system can compromise repeatability of SRAM start-up behavior. To obviate this problem, a number of solutions such as fuzzy...
The fuzzy T — norms and T — conorms offer alternatives to compute the classical structural polynomial of a complex circuit. The reliability of a special complex 4-node circuit were evaluated, and it is show that, among a certain family of classic T — norms, the Frank T-norm provides a T — map emerging from the structural polynomial, which proves to be the best estimate for this reliability. Illustrative...
As memory technology scales down, memory cells tend to become unreliable. To guarantee reliable operations of circuits and systems, semiconductor devices are tested with accelerated life tests to estimate device-level reliability and to develop a predictive reliability model for circuits and systems based on the estimated reliability of devices. However, to accurately estimate the lifetime of a system,...
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