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Present and future semiconductor technologies are characterized by increasing parameters variations as well as an increasing susceptibility to external disturbances. Transient errors during system operation are no longer restricted to memories but also affect random logic, and a robust design becomes mandatory to ensure a reliable system operation. Self-checking circuits rely on redundancy to detect...
The Niagara2 CMT system-on-chip incorporates many design-for-test features to achieve high test coverage for both arrays and logic. All the arrays are tested using memory built-in-self-test. This is supplemented with scan-based testing. Logic is tested with standard ATPG for slow-speed defects and extensive use of transition test, along with logic built-in-self-test for the SPARC cores, for at-speed...
This paper studies the impact of intra-die random variability on low-power digital circuit designs, specifically, circuit timing failures due to intra-die variability. We identify a new low-Vdd statistical failure mode that is strongly supply-voltage dependent and also introduce a simple yet novel method for quantifying the effects of process variability on digital timing - a delay overlapping stage...
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