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Sn-3.0Ag-0.5Cu lead-free solder, PCB copper clad laminate and copper thin film substrate were used as experimental materials and the Cu/SAC305/Cu interconnection plate-level structure micro-solder joint was prepared by pulsed hot-pressing welding test. The author aimed at investigating the pulse welding time, pulse welding temperature and welding pressure which influence on the microstructure of solder...
As the electronic packaging density continues to increase, flip chip or stacked packaging via bump bonding is gradually replacing traditional wire bonding and will become the mainstream packaging form in the future. For copper bumps, this new type of electronic interconnection has not yet been fixed by industry standards. Therefore, this paper has made a preliminary study on the reliability of this...
We report an effective approach to inhibit the consumption of Cu during multiple reflows of SnAg2.3 solder on Cu. By depositing a very thin layer of the solder on Cu and followed by a 10-min reflow, the scallop-type morphology of the interfacial Cu6Sn5 intermetallic compounds (IMCs) became flat and the channels between them closed up. When additional solder was deposited on the sample and reflowed...
The as-soldered microstructures of intermetallic compounds (IMC) in Sn-Ag/Cu joint were investigated under different soldering temperatures and cooling rates. Scalloped, faceted, prismatic and hexagonal shape Cu6Sn5 grains were observed at the solder/Cu interface, respectively. Scalloped shape grains were found at 250°C. At higher soldering temperatures such as 275 °C and 300°C, faceted grains were...
This study, mainly emphasis on effects of solder volume on interfacial diffusion kinetics and mechanical properties of Sn/Cu microbump solder joints. Different thicknesses i.e. 12 μm Sn (electrodeposited) and 100 and 200μm Sn is screen printed over 14 μm thickness Cu under bump metallization (UBM). The diameter of Cu UBM used in this study is 50, 110 and 240μm respectively. Solder joints are subjected...
The effects of the rare earth Ce element on melting temperature, wettability of Sn-0.3Ag-0.7Cu low-Ag lead-free solder and the intermetallic compounds morphologies of Sn-0.3Ag-0.7Cu-XCe/Cu were investigated. The addition of the Ce element has an unconspicuous effect on decreasing the melting temperature of Sn-0.3Ag-0.7Cu solder. The results indicate that the addition of Ce element increases the wettability...
This work compared the interfacial reactions of single crystal Cu and polycrystalline Cu with the high-Sn solders. The morphology aspects of Cu6Sn5 intermetallic compound (IMC) grains formed between (001) single crystal Cu and high-Sn solder bath (pure Sn, Sn-0.7Cu, Sn-3Cu) at 250degC and 300degC for different durations ranging from 10 s to 10 min were investigated. The Cu6Sn5 grains formed in all...
Solder joint reliability is dependent on both thickness and morphology of the intermetallics that form and grow at the solder joint interface during soldering and subsequent thermal ageing and examining the morphology of these intermetallics is of great importance. The focus of this paper is to present experimental results of a comprehensive study of the interfacial reactions during soldering of Sn-Ag-Cu...
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