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Solder paste is a homogeneous and kinetically stable mixture of solder alloy powder, flux, and vehicle, which is capable of forming metallurgical bonds at a given soldering condition. The thermal properties of tin/silver/copper (SnAgCu) alloy nanoparticles of different sizes were studied by differential scanning calorimetry (DSC). The particle size-dependent melting point and latent heat of fusion...
High density polyethylene HDPE/SiO2 nanocomposites were prepared by melt compounding using a twin screw extruder. The thermal properties of the composites were investigated by differential scanning calorimetry (DSC). The microstructures of nanocomposites were characterized by scanning and transmission electron microscopy (SEM and TEM). The dielectric breakdown strength of the nanocomposites was investigated...
Tin/silver alloy nanoparticles with various sizes were synthesized by the chemical reduction method and their thermal properties were studied by differential scanning calorimetry. Both the particle size dependent melting temperature and latent heat of fusion have been observed. The melting point can be achieved as low as 194degC when the diameter of the nanoparticles is around 10 nm. The 64 nm (average...
Tin (Sn) nanoparticles with various sizes were synthesized from a chemical reduction method. Their morphological and thermal characterizations were studied. The high resolution transmission electron microscopy (HRTEM) study showed that significantly low level of oxides was formed. The thermal characterization by differential scanning calorimetry (DSC) exhibited the size dependency of the melting points
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