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This study investigated the relations between base resins and flux compounds applied to NCF (Non Conductive film) for thermal compression bonding with micro Cu pillar bumps. As the use of NCF expands, outgas during flip-chip bonding process is being recognized as a serious problem because it lowers both of the productivity and the package quality. The flux compounds which are normally used to get...
As the number of electronic components in automobiles increases, the electronic industry has seen an increasing demand for organic packaging materials that meet property requirements for long operations in harsh environments. One of the most challenging requirements for molding compounds for automotive electronics is high thermal stability. The plastic encapsulation material should survive continuous...
Agarwood, also known as Gaharu in Malaysia, is a fragrant and valuable international commodity harvested from Aquilaria and Gyrinops tree species. The quality of agarwood depends on many factors, such as the quality of its wood resin, smell and origin. Current methods for determining its quality rely on human experts. However, an automated approach would be more suitable for mass production. In this...
This paper presents a review on agarwood and its quality determination. It was found that Aquilaria Malaccensis is the main species in Malaysia and Indonesia. The agarwood has different quality or grades; similarly its essential oil. They are traded at different price according to their quality. Scientific reason showed that chemical compositions of agarwood make them different from each other, thus...
This paper introduces a new wet chemical surface preparation process for plating on molding compound. The approach is based on an innovative combination of mechanical anchoring by selective etching and chemical adhesion. Plating on molding compound substrates is a relatively new field with many possible applications. One major application is magnetic or electrical magnetic shielding of active components...
Bonded anisotropic Nd magnets with high-energy product \(({\textit{BH}})_{\max }\) of 20MGOe and freedom of shape design are effective in realizing motor size and weight reductions. The anisotropic powders were produced by d-HDDR treatment, grain boundary diffusion treatment with NdCuAl, and powder surface coating treatment. However, during the compression molding process, the molding pressure can...
This paper present a study of casting compounds used in the electrical industry, especially in manufacturing and repairs of electric rotary machines. The basic types of casting resins and their basic application in the electrical industry are described. This paper focuses on electrical and mechanical properties of selected casting resins. The chosen diagnostic system should give an objective point...
The constant drive to further miniaturization and heterogeneous system integration leads to a need for new packaging technologies which also allow large area processing and 3D integration with potential for low cost applications. Large area mold embedding technologies and embedding of active components into printed circuit boards (Chip-inPolymer) are two major packaging trends in this area. Mold embedding...
Chitosan resin grafted by quercetin (QCR), the adsorbent, was used as for the separation of flavonoids. The optimum conditions were determined by automatic liquid chromatography system. Moreover, the hydrophobic interaction between the flavonoids and QCR could be useful for the effective adsorption and separation.
In this paper, cephamycin C purification using column adsorption processes was investigated. Two polymeric resins were used, Q-Sepharose XL, an ionic resin, and Amberlite XAD-4, a neutral one. The column process using QXL separated two fractions with antibacterial activity. Cephamycin C was present only in the first fraction, called F1, but was not pure. In the column process using the resin XAD-4,...
Microchip encapsulation processes involves complex tooling and molding intricacies that affect moldability and quality yield in transfer molding process of packages. Wire sweep during molding is a major concern to mold engineers as the wire deformation behaviour during encapsulation is difficult to realise and control. Hence, analyzing the effects of polymer flow around circuit wires can help to identify...
The moisture absorption experiments of 8 kinds of molding compound and two kinds of organic substrate at 30°C/60% RH was performed to evaluate the moisture absorption performance. Organic substrate absorbed more moisture than molding compound, which provides validation of baking process before die attach during assembly, and possible cause of inter-layer popcorn during ball attach or solder reflow...
Thermal stability and color change of carnauba wax, ester wax, OP wax, S wax, stearic acid, GMS and a few polyethylene wax types were investigated by heating them to a specific temperature 175C for about 50hours. Cluster analysis was adopted by analyzing the weight loss of the wax. Based on the weight loss data, these wax can be divided into three groups, the most stable group which includes carnauba...
Epoxy resins made from natural materials have numerous advantages over those made from petroleum derived chemicals. Isosorbide and its isomers, isomannide and isoidide, can react similarly to bisphenol A to produce diglycidyl ethers that may be used as epoxy resins. These materials have comparable mechanical properties to bisphenol A based epoxies when produced under similar conditions. However, the...
This study discusses the water treatment technology, which could be used to accelerate the effectiveness of ozonation process when it is combined with the process of ion exchange. An effluent from a municipal wastewater treatment plant in Taipei is employed as the target sample. The results show that by ozonation alone, the TOC removal from the effluent could be achieved as maximum up to 49%. Further...
Formic acid hydrolysis is widely used in lignocellulose pretreatment. However, formic acid hydrolysis wheat straw cannot be directly used as a fermentation substrate owing to various fermentation inhibitors, especially the formic acid in reaction system and released during pretreatment. Study found treatment of wheat straw hydrolysate with D311 ion-exchange resin had a good result on reduction formic...
Stress induced parametric shifts caused by packaging are a major source of yield loss in precision devices. Package stress induced parameter shifts can be decomposed into two parts, a mean shifting component and a distribution broadening component. The mean shifting component is systematic and can be compensated in the circuit design phase or by laser-trimming thin film resistors if package stresses...
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