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Copper (Cu) wire has been highlighted as a low cost material for use in thermo sonic ball bonding for various package (PKG) groups. This wire has already been applied in high-end PKGs such as BGA, QFP and QFN in mass production, and the volume is feasible. Not only the advantage of a low cost material, but Cu wire has other merits which include higher electrical conductivity and a much slower intermetallic...
A detailed description of the Cu-Al wire bond interface is presented, which can possibly explain the often observed corrosion failures in humidity reliability tests. Using micro-structural analysis techniques, it is shown that the unstressed interface contains up to three intermetallic phases, where the Cu-rich phases are located at the Cu-ball interface. Upon humidity stress test only the high-Cu...
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