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With the development of ultra-large scale integrated circuits, ruthenium has been used as one of the most promising barrier materials for copper interconnects by replacing the conventional Ta/TaN bilayer film. However, during the polishing process of Ru/Cu structure using KIO4 slurries, the galvanic corrosion of copper could happen due to the large difference of the corrosion potentials between ruthenium...
This work presents energy harvesting techniques from low-voltage current used to prevent galvanic corrosion between a metallic structure and a permanent copper/copper sulfate (Cu/CuSO4) reference electrode. Supercapacitors are adopted to compensate for or overcome the limitations of batteries. Then, a boost converter is used to convert the low voltage levels of galvanic corrosion to that needed by...
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