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Package reliability depends on the integrity of the interface between various materials. Key interfaces are between epoxy-based mold compound to leadframe and chip surfaces. In the present work, the adhesion of epoxy-based mold compound and copper leadframe with various finishing is being discussed. It is observed that dendrite like feature on the leadframe finishing is critical to prevent delamination...
SAC-Ti alloys exhibited significantly improved drop test performance over not only SAC alloys, but also 63Sn37Pb for ENIG/OSP, NiAu/OSP, and OSP/OSP surface finish systems. The superior performance is attributed to (1) the increased grain size and dendrite size, therefore reduced hardness of solder, (2) inclusion of Ti in the IMC layer, and (3) reduced IMC layer thickness. DSC data indicate that the...
Considering that the mechanical behavior plays a very important role in the packaging reliability, this study examined the shear deformation properties of pure Sn joints with different substrate materials and various gap sizes. The proeutectic Sn dendrites were refined and the shear strength was increased with a shrunken sample gap. The interfacial intermetallic compounds (IMCs) were thickened slightly...
Electromigration and thermomigration in the flip chip package are apparent in the reliability test. The 99.3Sn-0.7Cu/96.5Sn-3Ag-0.5Cu composite flip-chip solder joints with Ti/Ni(V)/Cu under bump metallurgy and different surface finishes are investigated when applied current density of 10 kA/cm2 and 15 kA/cm2 at 150degC and 125degC, respectively. Experimental results show the solder migrates to the...
Electrochemical migration (ECM) of lead-free solder joints were investigated by water drop test method. Nine types solder pastes were employed to compare the ECM susceptible. The effects of applied voltage, electrodes spacing and flux residue on the ECM were in-situ observed. The microstructure and composition of the growing dendrites during ECM were detected. The results revealed that higher voltage...
In this paper, a microstructure-dependent creep model is developed that accounts for the hierarchal micro structure at multiple length scales. The model considers three distinguishable phases in the solder alloy at two different length scales: at the larger scale Sn dendrites of micrometer size are embedded in a homogeneous eutectic phase; at a much smaller length scale the eutectic phase consists...
The scope of this study is to investigate the influences on the solidification of the micro structure of SnAgCu solders. It will be shown that the solidification process depends on solder composition, specimen size and manufacturing conditions. The influence of solder composition has been investigated on bulk solder ingots by varying the Ag content from 3.0 wt% to 3.8 wt% and the Cu content from 0...
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