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Nanoscale silver paste has a good application prospect in heat dissipation of high-power chips due to the characteristics of low temperature sintering and high temperature service. The properties of the nanosilver paste including thermal conductivity, electrical conductivity, and shear strength are affected greatly by the sintering process. The influence of different sintering methods on the performance...
The heat dissipation problem is becoming a crucial barrier in the continuous process of electronic devices and systems miniaturization, and thermal interface materials play a key role in transport at all level microelectronics packaging. In this chapter, thermally conductive composites, as one of the main types of thermal interface materials are discussed. Such composites consist of the polymer base...
Recently, to accurately study the transient thermal behavior of power modules, a transient thermal measurement system was developed to investigate the transient thermal behavior of insulated-gate bipolar transistor (IGBT) modules attached by nanosilver paste and two kinds of lead-free solders. We found that the transient thermal impedance of IGBT modules attached by nanosilver paste was 9% lower than...
This research deals with the investigation of novel nanosilver filled conductive adhesives and pastes for application in electronics packaging. Compared to conventional soldering-based interconnection technology, electrical conductive adhesives are believed to have the following advantages: finer pitch capability, lower processing temperature requirements, more environmentally friendly than lead-containing...
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