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For the double-sided assembly, thermal stress is one of the key factors that affect the reliability of the assembly. Therefore, we need to reduce thermal stresses in the double-sided assembly by optimizing size and structure. In this study, we fabricated a kind of double-sided assembly using metal tubes instead of bonding wires because the metal tube could load the higher current density than bonding...
For decades, soldering has been the technology of choice in die bonding for power electronics applications. However, conventional solders cannot meet the requirement for high-temperature applications. Recently, a low-temperature sintering technique involving a nanosilver paste was developed for attaching semiconductor chips to substrates. Sintered nanosilver joints showed high reliability in high-temperature...
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