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In this paper, we comprehensively investigate the fatigue life and the failure modes of horseshoe-patterned stretchable interconnects, through both experimental and numerical analysis. The experimental results demonstrate that the fatigue life of a horseshoe-patterned stretchable interconnect embedded into a silicone matrix is able to resist up to 3000 cycles for a uniaxial elongation of 10%. By increasing...
With more reliability requirement increasing in the IC packaging for mobile product, the industry has been searching for a more cost-effective and time-effective way to achieve the evaluation task. In light of the long cycle time of thermal cycle testing, we investigated the mechanical fatigue test instead of thermal cycle testing for shortening test time. The 4-point cyclic bending test is considered...
With the development trend of microelectronic system with small size, high speed, high frequency and high density, passive and active components are directly embedded into a core or high-density-interconnect layers. This System-in-Package (SiP) technology could shorten interconnection between the die and substrate and reduce the inductance and noise interference. However, there are many electrical...
PbSnAg solder was widely used in die attachment for high power chip packaging, and the thermal-mechanical reliability of PbSnAg solder layer is a key factor to evaluate the quality of high power devices packaging. Viscoplastic finite-element simulation methodologies were utilized to predict Pb92.5Sn5Ag2.5 solder joint reliability for die attachment under accelerated temperature cycling conditions...
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