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The charged-device-model (CDM) ESD robustness of core circuit with/without the shielding line was studied in a 65-nm CMOS process. Verified in silicon chip, the CDM ESD robustness of core circuit with the shielding line was degraded. The damage mechanism and failure location of the test circuits were investigated in this work.
We propose the novel 3-dimensional (3-D) vertical floating gate (FG) NAND flash memory cell arrays with novel electrical source/drain (S/D) technique using Extended Sidewall Control Gate (ESCG). Cylindrical FG structure cell is implemented to overcome the reliability issues of the charge trap cell such as SONOS and TANOS cell. We also propose the novel electrical S/D layer using the ESCG structure...
Self-aligned shallow trench isolation recess effect on 42 nm node NAND flash to achieve high performance and good reliability has been studied and demonstrated. As cell STI recess is increased by 23 nm, 29% narrower cell Vth distribution width and 54% less cell Vth shift after 125°C, 2 hours can be obtained. Furthermore, the endurance window is obviously improved ~0.5V as the distance of the active...
EEPROM cell with n-well and MIM capacitor is proposed and fabrication is done by using the 0.18??m standard CMOS process. Single polysilicon EEPROM cell applies the stacked metal-insulator-metal (MIM) or n-well capacitor to increase a memory capacity. Although MIM capacitor cell shows a good device performance, it requires a large device-size. N-well control gate cell has an inherent high junction...
Crosstalk faults have emerged as a significant mechanism for circuit failure. Long signal nets are of particular concern because they tend to have a higher coupling capacitance to overall capacitance ratio. A typical long net also has multiple aggressors. In generating patterns to create maximal crosstalk noise on a net, it may not be possible to activate all aggressors logically or simultaneously...
In this paper, we present a new technique to improve the reliability of H-tree SRAM memories. This technique deals with the SRAM power-bus monitoring by using built-in current sensor (BICS) circuits that detect abnormal current dissipation in the memory power-bus. This abnormal current is the result of a single-event upset (SEU) in the memory and it is generated during the inversion of the state of...
The reliability of advanced embedded non-volatile memories has been discussed using the 2T-FNFN devices example. The write/erase endurance and the data retention are the most important reliability parameters. The intrinsic reliability mechanisms can be addressed through single cell evaluation, while the cell-to-cell variation determines the product level reliability. The cell-to-cell variation can...
3D contactless technology based on capacitive coupling represents a promising solution for high-speed and low power signaling in vertically integrated chips. AC coupled interconnects do not suffer from mechanical stress, and the parasitic load is much reduced when compared to standard DC solutions, such as wire bonding and micro bumps. Communication system based on wireless interconnection scheme...
In deep submicron era, to prevent larger amount of SRAM from more frequently encountered overheating problems and react accordingly for each possible hotspots, multiple ideal run-time temperature sensors must be closely located and response rapidly to secure system reliability while maintaining core frequency. This paper presented a method to extract run-time temperature information from multiple...
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