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Some of the primary concerns in integrating domestic scale renewable energy systems in city buildings is siting optimization and size scaling of domestic wind turbine models on building roof tops discounting the zone of wake influence. This is a Case study scenario of a regional wind resources distributions and predominant wind directions computation for CFD modeling to identify laminar and turbulent...
The relentless trend of ever increasing integrated circuit chip functionality and decreasing chip dimensions for miniaturization of products have led to intense heat dissipation in IC chips. The problem of effective cooling of chips at an acceptable cost is now becoming an urgent issue (Guenin, 1997). Leadframe CSP package is a promising candidate for portable wireless applications such as Bluetooth...
This paper presents the various types of thermally enhanced flip chip packages and its thermal characterization with thermal management options at package level. The conventional one-piece lid high performance flip chip BGA package (HP-fcBGA) has its strength in good thermal dissipation capability, however its board level solder joint reliability could be comprised due to the direct contact of the...
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