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IEEE Electron Device Letters > 2012 > 33 > 5 > 685 - 687
IEEE Transactions on Industry Applications > 1987 > IA-23 > 6 > 1084 - 1087
IEEE Transactions on Industry Applications > 1987 > IA-23 > 6 > 1001 - 1009
IEEE Transactions on Industry Applications > 1987 > IA-23 > 5 > 937 - 943
IEEE Transactions on Industry Applications > 1987 > IA-23 > 3 > 532 - 537
IEEE Transactions on Industry Applications > 1987 > IA-23 > 2 > 256 - 262
IEEE Transactions on Industry Applications > 1987 > IA-23 > 1 > 78 - 84
IEEE Transactions on Industry Applications > 1987 > IA-23 > 6 > 1010 - 1015
IEEE Transactions on Industry Applications > 1987 > IA-23 > 4 > 654 - 660
IEEE Transactions on Industry Applications > 1987 > IA-23 > 4 > 644 - 653
IEEE Transactions on Industry Applications > 1987 > IA-23 > 4 > 760 - 763
IEEE Transactions on Industry Applications > 1987 > IA-23 > 3 > 561 - 566
IEEE Transactions on Industry Applications > 1987 > IA-23 > 3 > 545 - 553
IEEE Transactions on Industry Applications > 1987 > IA-23 > 2 > 263 - 269
IEEE Transactions on Industry Applications > 1987 > IA-23 > 1 > 85 - 89
IEEE Transactions on Industry Applications > 1987 > IA-23 > 5 > 887 - 893
IEEE Transactions on Industry Applications > 1987 > IA-23 > 5 > 911 - 920
IEEE Transactions on Industry Applications > 1987 > IA-23 > 4 > 661 - 672
IEEE Transactions on Industry Applications > 1987 > IA-23 > 1 > 173 - 180