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Different from permanent magnet synchronous machine, switched reluctance motor(SRM) is featured as high local flux density, high current variation ratio in the winding with medium, high power and high speed. Therefore, hot spots in the winding could be caused by eddy current effect. When current flows through winding, skin effect is generated by the high frequency alternating current due to the high...
With the introduction of several new coding tools and technology for depth maps in 3D-HEVC, the coding efficiency is improved at the expense of computational complexity. Meanwhile, the inter-view correlation is not considered and used well for depth maps, while it is developed maturely in texture video coding. Therefore, in this paper, we propose an early determination scheme for the best prediction...
The 3D extension of the High Efficiency Video Coding (HEVC) standard achieves large compression rates thanks to the addition of several tools to encode multiview and depth information on top of those available in HEVC. The use of such tools incur in a very large computational demand, which can be a serious problem in power and computationally-constrained devices and applications. However, not all...
This study reports the design and experimental results of a fully-passive solid-state RF switch based on the Conductive Bridging Memory Technology, popularly known as CBRAM. The developed device is a shunt mode RF switch based on a Metal-Insulator-Metal (MIM) structure with Copper — Nafion — Aluminum switching layers on a Coplanar Waveguide (CPW) transmission line, operational in the DC to 3GHz range...
Bioluminescence is a natural phenomenon exhibited by many organisms, in which energy is spent to emit light. These organisms emit light through an enzymatic reaction between the substrate Luciferin, and an enzyme Luciferase. The Lux operon controls the process of luminescence, which follows the quorum sensing mechanism. We used the idea of bioluminescence to develop a photobiosensor to detect the...
This work investigates the impact of the dielectric material on the stressmigration based on modeling of 3D numerical simulations. Particularly noteworthy is the study for structures that incorporate so-called air-gaps. Contrary to the expected, the stress developed in the AG structure was larger than in the standard ones. The standard structure with SiCOH shows a magnitude of 450 MPa at the Cu/capping...
A new class of lightweight, multifunctional material has been developed for electromagnetic compatibility. This material, branded VeeloSTRIKE, was designed to provide lightning strike protection, broadband shielding, and electrical uniformity in carbon fiber reinforced polymer composites. Aerospace and defense prime contractors and integrators are evaluating this proprietary carbon nanotube blended...
Grounding system plays very important role in AC substation station for person and equipment safety. Proper design of grounding system is achievable by following IEEE Std-80 on safety in AC substation grounding but novice professionals find it not easy to use. The advantage of this paper presents evaluation of grounding system for AC substation by case studies presentation thus easing the understanding...
A sensitivity-enhanced temperature sensor for marine monitoring based on fiber Bragg grating (FBG) has been proposed and experimentally investigated. The temperature sensor has been realized by electroplating a copper coating on a metalized FBG. Then, the coated FBG is packaged by a carbon film, which protects the copper coating from being corroded when the sensor is used in the ocean. The carbon...
Accurate parametric models capable of describing the electrical characteristics of short twisted-pair cables operating at relatively high frequencies are key elements for design the next generation broadband over copper. In this paper we present an experimental procedure for refining the parameters of a well-known 1% worst-case crosstalk model in order to better characterize these new transmission...
We present a novel approach to fabricate microwave passive components using very cheap SLA 3D printing technology associated with copper electroplating of the resulting 3D plastic structures. Some test structures are presented showing the excellent performance of the process.
In this work we present the performance of metallic (copper and aluminum) and graphene buckypaper based microstrip transmission lines and the comparison between these device configurations. The graphene buckypapers were deposited by a simple vacuum filtration method, leading to freestanding paper with 350 Dm thickness and diameter up to 1.2 inches. After deposition and drying, the graphene paper and...
In order to investigate the reliability of micro-interconnecting copper pillar bump under thermal-electric coupling, the test chip with electrified daisy chain copper pillar bumps was designed and manufactured. And 9 sets of thermoelectric coupling accelerated life test were carried out respectively, which the resistance increased by 10% was considered as the failure threshold to get the mean-time-to-failure...
Aluminium is widely used as conductor material for power cables, but corrosion taking place under specific circumstances can have impact on its reliability. Aluminium corrosion under the influence of an alternating current was studied experimentally. Submerged cable segments with inflicted damage exposing the conductors resulted in a continuous corrosion of the conductor material. Effects of temperature...
In this study, we perform a top gate field effect transistor by using the integration of novel materials such as graphene as active channel and fluorinated graphene as dielectrics on flexible Polyethylene terephthalate (PET) substrate. These device shows high carrier mobility (∼969 cm2/v.s) at a drain bias of +0.5V. It shows good mechanical flexibility and electrical stability after bending measurement...
In this study, a comparison of the interfacial adhesion strength of Plasma Enhanced Chemical Vapor Deposition (PECVD) silicon nitride (SiN)/Cu and High-Density Plasma Chemical Vapor Deposition (HDP CVD) SiN/Cu was performed using the 4-Point-Bending (4PB) technique. Differences in critical energy release rate value Gc, which is an indicator of the interfacial adhesion strength, were observed. The...
In situ lift out is a mature and well established technique for TEM sample preparation [1]. There are occasions though, when lift out fails, and the TEM lamella falls into the TEM trench during sample preparation. In a previous study [2], the lamella can be rescued through a series of steps involving welding, tilting, cutting free and rewelding the lamella onto a grid or die. In this paper, we detail...
Electrochemical migration (ECM) pose a high reliability risk to semiconductor devices. In this study, an ECM caused electrical failure case detail was shared, relevant electrical failure & ECM mechanism was also analyzed. To verify the failure mechanism discussed in this paper, ECM process was simulated on the same chip substrate. Besides, for the first time, the effect of chloride ion concentration...
Ultrasonic cleaner is a workhorse in all failure analysis labs for residue removal after decapsulation or etching. In this paper, we present a novel method of ultrasonic decapsulation, where acid mixture was used in conjunction with ultrasonic agitation and was discovered to provide exceptionally high quality preservation of the surface of the copper bond wires which exceeds the quality of laser decap...
Spectrum sensing is the fundamental technology of Cognitive Radio (CR). This paper proposes a novel multiple-antenna based spectrum sensing method with random arrivals of primary users (PUs). The method first constructs a local test statistic for each antenna based on the assumption that the PU is randomly arriving, and then calculates the estimated optimum coefficient for every local test statistic...
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