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Owing to the growing heat removal issue in modern electronic devices, electrically insulating polymer composites with high thermal conductivity have drawn much attention during the past decade. However, the conventional method to improve through‐plane thermal conductivity of these polymer composites usually yields an undesired value (below 3.0 Wm−1 K−1). Here, construction of a 3D phonon skeleton...
In article number 1703695, Zung‐Hang Wei and co‐workers design a microscaled thermoelectric component featuring a nanogap of varying sizes between the tips. A narrow gap tip generates stronger thermoelectric effects, because the phonon's contribution to thermal conductivity can be virtually neglected. Furthermore, the thermoelectric effects of the nanogap are intensified by adding nanoparticles, which...
This study designs a microscaled thermoelectric component featuring a nanogap of varying size (133–900 nm) between the tips of the component. Electricity and heat are transmitted between the gap of the tips through the thermionic emission of electrons. Because the gaps exhibit a discontinuous structure, the phonon's contribution to thermal conductivity can be virtually neglected, thereby enhancing...
To guarantee the normal operation of next generation portable electronics and wearable devices, together with avoiding electromagnetic wave pollution, it is urgent to find a material possessing flexibility, ultrahigh conductive, and superb electromagnetic interference shielding effectiveness (EMI SE) simultaneously. In this work, inspired by a building bricks toy with the interlock system, we design...
Due to substantial phonon scattering induced by various structural defects, the in‐plane thermal conductivity (K) of graphene films (GFs) is still inferior to the commercial pyrolytic graphite sheet (PGS). Here, the problem is solved by engineering the structures of GFs in the aspects of grain size, film alignment, and thickness, and interlayer binding energy. The maximum K of GFs reaches to 3200...
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