The purpose of this work is to show the effects of drop impact on the creep-fatigue evolution of solder balls in an electronic device. Finite element method analysis was carried out for evaluation of stress and strain distribution in the solder joints. According to the simulation outcomes, the thermal cycling made an accumulated creep strain in the solder balls. The concentration of creep strain considerably increased with the coupling of drop impact into the thermal cycling. This event was owing to the excessive stress exerted on the samples by drop impacts. The stress analysis also indicated that with the addition of drop impacts into the thermal cycling intensified the stress triaxiality at the interfaces. Moreover, the experimental works were done and determined the elemental heterogeneity phenomenon in the solder joints and crack propagation along the interface.