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In this work, low temperature of 200 °C, low pressure of 0.1MPa, fluxless and plateless Cu-Cu bonding in SiC power module is achieved by the transient phase liquid sintering (TLPS) of Cu nano particle and Sn-Bi eutectic powder. In this paper, shear strength at room temperature and 150 °C of two compositions of Cu mixed with Sn-Bi is investigated and the factor influencing the shear strength at 150...
This work is the first to achieve a low temperature (≦250 °C) and low pressure (≦0.1 MPa) fluxless bonding of plateless Cu-Cu substrates by transient liquid phase sintering (TLPS) of Ag nanoparticles and Sn-Bi eutectic powder. Sintering was conducted under formic environment to assist the wetting of Sn-Bi and to suppress the oxidation of Cu substrate. Effect of mixture composition to the shear strength,...
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