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A 3D packaging based 4-channel X-band receiver module is implemented using low temperature co-fired ceramic (LTCC) technology. A dual-mode X-band bandpass filter (BPF), an lumped-element branch-line coupler and an lumped BPF is proposed for the receiver module, respectively. The overall size of the module is only 54 mm × 60 mm × 1 mm. The measured gain parameter, noise figure (NF), image rejection...
We propose a built-in test circuit to detect resistive open defects occurring at interconnects between dies of 3D ICs. The test circuit consists of an I-V converter and a comparator of offset cancellation type. Feasibility of the tests with the circuit is examined by SPICE simulation. It is shown that resistive open defects of 5Ω and above can be detected per 240nsec under process variations of MOSs...
We have proposed a power supply circuit and an electrical interconnect test method based on charge volume supplied from the power supply circuit. We optimize the supply circuit so as for small resistive open defects that occur at interconnects among dies in 3D stacked ICs to be detected by the test method. We examine what resistive open defects can be detected with the optimized power supply circuit...
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