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Cu to Cu bonding technology of IC package has the potential to replace solder joint in Future trends. The Cu to Cu bonding technology compared with other joint methods for IC package, it can solve the reliability problems such as electromigration, brittle intermetallic compound or other issues. At present, Cu to Cu bonding methods have been wide developed, but the microcosmic mechanisms of Cu to Cu...
Drop test for solder joint reliability is critical for all area arrays and perimeter-leaded surface mount semiconductor devices typically used in handheld electronic products. Joint Electron Device Engineering Council, JEDEC, published a new test standard, JESD22-B111A, to be the revision of the JESD22-B111 for board level drop test in November, 2016. The major differences between JESD22-B111 and...
The presence of common-mode noise in differential lines is a major contributor to signal integrity problems in high-speed digital systems. Common-mode noise is typically excited by skew. It can occur due to timing mismatches at the driver, length mismatches due to routing constraints, or phase velocity mismatches due to inhomogeneous dielectrics with fiber-weave effect. Common mode noise results in...
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