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Comprehending material, technology and design interaction with key reliability metrics is becoming critical to ensure successful product introduction with continued scaling beyond 10nm. This paper summarizes the key challenges for reliability and its implication for the design/technology co-optimization. Building in reliability requires a detailed understanding of material properties, device architecture...
3D sequential integration requires top FETs processing with a low thermal budget (500°C). The analysis of the origin of the performance difference between Low Temperature (LT) MOSFET and high temperature standard process must take into account a potential EOT modification for short gate lengths. In this work, the difficulty of precise EOT extraction for scaled devices is observed by CV measurements...
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