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3-Dimentional (3D) X-ray imaging significantly increases the visibility of the bond wires and lead frame structures of the complicated integrated circuits (IC) packages, particularly for the less visible Copper (Cu) bond wires used in more recent IC devices. It has become a very useful and effective technique for detecting package related failures without going through the lengthy physical analysis...
In this study, we introduce high-resolution X-ray tomography into the daily failure analysis (FA) work flow for semiconductor packages. Two application cases, the investigation of Back-end of line (BEOL) and μ-bump features have been selected to demonstrate its advantage. The paper focuses on a feasibility study for different measurement parameters and proposes an advanced FA flow including newly-developed...
Carbon particle is not able to be detected by X-ray, so it is always a challenge to find out the defect mode if caused by conductive carbon particle in package. A non-destructive, quick and precious fault localization method with lock-in thermography (LIT) was demonstrated and follow up physical analysis (PFA) was performed. Consequently, conductive carbon particle was confirmed as the root cause...
Novel 3D architecture of electronics packages raises immense challenges for electrical fault isolation and physical failure analysis (PFA). This paper describes a streamlined workflow involving 3D X-ray Microscopy (XRM) to effectively bridge fault isolation and physical failure analysis (PFA). The case studies on chip-to-chip micro-bump interconnecting failure will be discussed. X-ray microscopy improved...
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