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Transmission electron microscopy (TEM) plays an important role in the structural analysis and characterization of materials for failure analysis in integrated circuit industry as device shrinkage continues. It is well known that a high quality TEM sample is the important factor. When the TEM sample was in preparation for cross-section or plane analysis, curtain effect and positioning are the problems...
3-Dimentional (3D) X-ray imaging significantly increases the visibility of the bond wires and lead frame structures of the complicated integrated circuits (IC) packages, particularly for the less visible Copper (Cu) bond wires used in more recent IC devices. It has become a very useful and effective technique for detecting package related failures without going through the lengthy physical analysis...
In this study, we introduce high-resolution X-ray tomography into the daily failure analysis (FA) work flow for semiconductor packages. Two application cases, the investigation of Back-end of line (BEOL) and μ-bump features have been selected to demonstrate its advantage. The paper focuses on a feasibility study for different measurement parameters and proposes an advanced FA flow including newly-developed...
A theory has been developed for geometric variation of trigate FinFETs. This geometric variation includes both line roughness induced variation and oxide-thickness variation, which can be measured from gate capacitance and Ig current variations, respectively. Experimental results show that trigate devices are subject to serious line variations as the fin height scales up and the fin-width scales down,...
3D-IC has been recognized as one of the technology solutions from More than Moore. Xilinx's 3D-IC FPGA has been well adopted by the industry since the first Virtex®-7 2000T introduced in 2011. In particular recently, data center requires large volume of 3D-IC for its applications. To fulfill the high demand effectively the best way is to provide the high yield and reliability 3D-IC product supply...
Novel 3D architecture of electronics packages raises immense challenges for electrical fault isolation and physical failure analysis (PFA). This paper describes a streamlined workflow involving 3D X-ray Microscopy (XRM) to effectively bridge fault isolation and physical failure analysis (PFA). The case studies on chip-to-chip micro-bump interconnecting failure will be discussed. X-ray microscopy improved...
We characterized plate-like Ni-Sn IMCs in the Sn-2.3wt.%Ag solder bump using high-resolution 3D X-ray microscopy and transmission electron microscopy. Two types of plate-like IMCs (type 1 and 2) were observed in the solder bump. The type 1 is composed of NiSn4, Ni3Sn4 IMCs and Ni. Type 2 is only composed of plate-like NiSn3 IMC. The crystal structures of meta-stable NiSn4 and NiSna IMCs are orthorhombic...
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