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Tail bits in the RESET process influence the distribution of resistive parameters, and will dramatically decrease the uniformity in high electric stimuli region. In this study, such phenomena can be explained as non-uniform distribution of defects in the insulating layer and high defects density in the bottleneck region of conductive filament (CF). Then departing from defects' distribution function,...
Four HfAlO based resistive random access memory (RRAM) devices with different HfO2 percentage (0%, 10%, 90% and 100%) were fabricated using atomic layer deposition (ALD). Three types of electroforming processes were observed with 1mA current compliance (CC), including initial high resistance state (HRS), initial medium resistance state (MRS) and initial low resistance state (LRS). The modulation of...
In this study, we compared the basic switching behaviors of HfO2, Al2O3 and HfAlOx (Hf:Al=9:1) based RRAM with Ti top electrode by setting various compliance currents (1mA, 5mA, 10mA, 15mA). The resistance ratio of HfO2 based RRAM (20 → 320) increases with compliance current whereas it drops not obviously for Al2O3 based RRAM (85→54). HfAlOx (Hf:Al=9:1)) based one has the best resistance ratio (300–440)...
Resistive Random Access Memory (RRAM) can be regarded as a promising candidate on the manipulation of both electrical and magnetic properties. There is a widespread concern about the electrical manipulation of magnetic properties in RRAM devices. In our work, Co/HfO2/Pt RRAM device with magnetic conductive filament (CF) is designed and fabricated. Then the anisotropic magnetoresistance (AMR) effect...
In this work, the high temperature (up to 375°C) dynamic characteristics of 1.2kV SiC VDMOS, including the gate charge, the switching and the body diode reverse recovery characteristics, are measured and analyzed in detail. The experiments show that, with the increase of temperature, the Miller plateau declines, the reverse recovery charge rises, the turn-on time decreases and the turn-off time increases...
ESD protection design for the RF transmit/receive switch (T/R switch) with embedded silicon-controlled rectifier (SCR) is proposed, where the SCR device is embedded in the ESD diode and the transistors of T/R switch by layout skill. Silicon chip verified in a 90-nm CMOS process has been measured by TLP and HBM ESD test to confirm its efficiency for ESD protection. The parasitic capacitance from the...
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