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This paper describes the use of Lock-In Thermography (LIT) technique to determine the defect Z-depth in flip chip. An empirical phase shift versus applied lock-in frequency plot for Flip-chip is first created by using samples with known defect Z-depth. The actual experimental phase shift data from reject samples with unknown defect locations are then measured and compared against the empirical phase...
The combined benefits of reduced package footprint, higher input/output capability, better power and ground distribution and reduced signal inductance has made the flip chip package technology a primary packaging solution for portable consumer electronics as well as commercial/industrial applications. The technology qualification step ensures the highest quality and reliability performance on devices...
Large scale and high density packaging of ASICs are usually achieved by FCBGA forms. The structure and materials are more complicated in FCBGA, which would cause reliability concerns in situations where thermo-mechanical stressing is dominant. Accelerated temperature cycling reliability test was performed on 90-nm/8-level copper based FCBGA packaging devices, and open failures dominated by thermo-mechanical...
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