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A nanocopper-based interconnect material was developed as a robust, high-performance alternative to solder. This new solder-free nanocopper material overcomes an inherent limitation of traditional solders wherein the operating temperature is limited by the processing temperature. For the first time, an interconnect material is capable of operating at temperatures not only equal to but even far above...
Mass production techniques to provide highly sensitive and low-cost antennas are demanded to achieve the Internet of Things. Printing is a suitable technique for mass production of low-cost antennas. In this study, three types of printed silver nanowire (AgNW) antennas were fabricated by preparing inks containing AgNWs of different width and length. Printed antennas of short, narrow AgNWs achieved...
The fabrication of a conductive 3D copper micropattern was studied by 3D printing method based on layer-by-layer laser direct writing using a copper nanoparticle ink toward 3D interconnection.
Printed electronics enable the fabrication of large-scale, low-cost electronic devices and systems, and thus offer significant possibilities in terms of developing new electronics/optics applications in various fields. Additionally, reducing the thickness of thin-film electronic devices is a primary goal in the field of flexible electronics, because it would improve the flexibility and lightness of...
Ink property for high-quality printed carbon nanotube (CNT) transistor was investigated and it was found that adhesion property of the semiconducting (s-) CNT micelles was a key issue. Anionic surfactants would prevent the s-CNT micelles from being adsorbed to the surface which was functionalized by amino groups and deteriorate the device characteristics. High-quality and high-uniform CNT transistors...
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