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The further growth of billions of wirelessly connected devices requires a technology infrastructure that can handle a massive increase in storage, computing power and bandwidth, some of it available via cloud computing, to enable number crunching at very large scale and at high volume, low cost and low power. The IoT applications or ‘smart devices’ require the following technology enablers: ultra-low...
3D sub-system integration of logic and DRAM with TSV is desirable for wide memory bandwidth and reduced power for mobile applications. However, its manufacturing cost, along with testing and heat dissipation, remains to be outstanding issues. A new integration technology platform, InFO, is proposed to address it. In this paper, we compare three main 3D integration architectures: InFO_PoP, FC_PoP and...
We demonstrate sub-5nm filament based electrochemical metallization RRAM with self-limited program in a reliable and controllable manner. This RRAM removes the necessity for any external current compliance in a 1TnR (1S1R) architecture. Furthermore, we report a novel technique to amplify RRAM's intrinsic ON/OFF resistance ratio by a factor of >104, which offers significant cell-, circuit- and system-level...
Internet and mobile application have been the driving force for semiconductor innovation in the past 10 years. In this paper, we will focus on the system requirement for today's and tomorrow's consumer gadgets from productivity laptop computers to wearable glasses or watches. We will start with everyone's favorite activity such as taking pictures and sharing with friends, listening to the YouTube...
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