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A bonding technique, capable of sub-micron and finer alignment accuracy, has been developed for electronics-optics heterogeneous integration applications. The technique is based on the principle of misalignment self-correction using bump (convex) and hollow (concave) elements, to align one die (i.e. a chip) to another one (i.e. a substrate) during the stacking process. Conductive hollow pad and Au...
Ordered arrays of vertical silicon nanowires reflect vivid colors. Sensitivity of the colors to refractive-index of the surrounding medium was investigated and a resolution of 1.6×10−3 was achieved; resulting in a low-cost simple refractive-index sensor.
We report on polydimethlysiloxane (PDMS) microlenses fabricated from liquid-phase photopolymerization and a single molding step. The mold is fabricated by photopolymerizing a polyacrylamide (PAAm) pre-hydrogel flowed into an aperture array with a channel underneath. PAAm shrinks isotropically while pinned around the rim of the apertures to form lens molds due to hydrophobic-hydrophilic boundaries...
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