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Beginning in the mid-1990s, Sandia National Laboratories began its migration to Silicon-on-Insulator (SOI) wafers to develop a radiation-hardened semiconductor process for sub-0.5mum geometries. Successfully radiation hardening SOI technologies enabled an in-house processing familiarity that exceeded our expectations by opening opportunities to improve other technologies. Rather than rely on a single...
We present a novel method to realize 3D adiabatically Spot-Size Converter (SSC) structures by standard silicon micromachining technics, for efficient coupling from single-mode fiber or free-space to silicon photonic chip. The SSC is comprised of I/O waveguides and a 3D tapered coupler on silicon-on-insulator (SOI) substrate. The dimensions are decreased linearly in both vertical and horizontal directions...
This paper talks about the developments in silicon photonic devices which exploit the inherent high refractive index contrasts achievable on an SOI platform. We will focus on the optical modulator which has been designed for speeds up to 40Gbps. We will also describe the design and performance of a photonic integrated transmitter chip, which has been demonstrated to transmit at an aggregate data rate...
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