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microchannel heat sinks are considered a strong candidate for meeting the increasing cooling needs of high-power microprocessors of today and the significant future. Such heat sinks are capable of dissipating impressive amounts of energy, as a result of high attainable heat transfer and favorable heat transfer surface area to volume ratios. The majority of microchannel heat sink studies performed...
Thermal interface material (TIM) is a major hurdle in heat flow for typical chip/heat sink assemblies. In many electronic devices, hot spots occur in areas of high activity during the device operation. These hot spots can lead to high thermal gradients, which in turn result in performance and reliability hindrances. The elevated, non-uniform power density confronted with conventional TIMs that contain...
Hot spots on thin wafers of IC packages are becoming an important issue in thermal and electrical engineering. To investigate these hot spots, we developed a diode temperature sensor array (DTSA) that consists of an array of 32 times 32 diodes (1,024 diodes) in an 8 mm x 8 mm surface area. We used chemical-mechanical planarization to make DTSA chips with various thicknesses (21.5 mum, 31 mum, 42 mum,...
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