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In the electronics cooling literature, the use of the overall thermal resistance to describe the thermal performance of cooling technologies, has hindered the adoption of more robust and powerful thermal performance metrics, most notably the heat exchanger effectiveness, epsiv , that arises in the theory of heat exchangers. This paper presents a theoretical treatment of the heat transfer in cold plates...
Experiments were performed to investigate spray cooling enhancement on micro-structured surfaces. Surface modification techniques were utilized to obtain micro-scale indentations and protrusions on the heater surfaces. A smooth surface was also tested to have baseline data for comparison. Tests were conducted in a closed loop system with ammonia using RTFs vapor atomized spray nozzles. Thick film...
To address the thermal management challenges associated with high power dissipation devices, we describe a novel hybrid thermal management device, which enables significant enhancement of conventional air-cooled heat sinks using on- demand and spatially controlled droplet/jet impingement evaporative cooling. The device architecture modifies an air (gas)-cooled heat sink by adding a multiplexed, planar...
The ability to control mixing of reagents in MEMS systems is crucial for many biological and chemical analysis applications. However mixing in these microfluidic devices is a challenge because the flows are laminar corresponding to very low Reynolds number. In this paper, mixing of two aqueous reagents is studied in a "tau" shaped microchannel by means of computational fluid dynamics (CFD)...
This paper presents modeling and simulation techniques for the the dynamic behavior of inertial sensors. A detailed model of a sensor is generated at the continuous field level, which considers multiple physical domains, such as structural dynamics, fluidics and electrostatics. To reduce the large order of the problem, a compact model is derived by decomposition of the deformation field into basic...
Thermal management of device level packaging continues to present many technical challenges. In the typical chip heat sink assembly, the highest resistance to heat flow comes from the thermal interface material (TIM). The thermal conductivities of TIMs remain in the range of 1-4 W/mK due to the properties and structure of small dispersed solids in polymer matrices. As a result of the rising design...
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