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Rapid development in the design of electronic packages for modern high-speed computers has led to the demand for effective methods of chip cooling. The primary concerns in thermal management applications are high thermal conductivity, large specific surface area and low weight. Graphite foams which possess predominantly spherical pores with smaller openings between the cells constitute a novel highly-conductive...
Digitized heat transfer, or DHT, is a new technique for the thermal management of electronic devices where discrete droplets are used in place of continuous flows. This paper investigates the thermal management potential of a DHT system through the numerical solution of the mass, momentum, and energy equations of a simplified droplet travelling between heated parallel plates. The analysis shows much...
The heat removal capability of area-interconnect-compatible interlayer cooling in vertically integrated, high-performance chip stacks was characterized with de-ionized water as coolant. Correlation-based predictions and computational fluid dynamic modeling of cross-flow heat-removal structures show that the coolant temperature increase due to sensible heat absorption limits the cooling performance...
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