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The ever-increasing size of wireless networks has led to the development of new base station architectures. Traditional telecommunication base stations have baseband and radio-frequency (RF) components mounted inside an air-conditioned hut with co-axial cables transmitting signals to remote antennas. The industry is moving to distributed network and remote radio head (RRH) architectures where the...
In high power electronics applications, the most preferred way of thermal management is the use of a heat sink and a fan for active cooling. Though this thermal solution is fairly adequate for the current heat dissipation needs, it suffers from some serious limitations, which may tend to limit its use with time. In the present study, we quantify the limitations of a conventional fan-cooled heat sink...
We propose a new concept of mounting structure for high- temperature operable power semiconductor devices such as Silicon Carbide (SiC) or Gallium Nitride (GaN) with high reliability. The proposed structure is composed by high purity aluminum (Al) as a circuit metal on substrate and high- temperature resistant joint material as a chip joint layer. In this structure, the circuit metal can deform easily...
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