The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The proposed innovative manufacturing process—described in detail—uses metal foam to create a pressed contact between the top side of a printed circuit board-embedded power die and the rest of the circuit. Initial prototypes were constructed using diodes with die dimensions of 4 mm $\times $ 6.35 mm. The prototypes were electrically characterized: the chip and contact dc and ac impedance values...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.