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In this paper, on-wafer de-embedding methods for passive components are evaluated for millimeter wave integrated circuit (MMW IC) design support. An electromagnetic simulation aided de-embedding (EMSAD) technique is proposed. The electromagnetic model is calibrated by matching the open-short de-embedded measurement at relatively lower frequencies. A set of Ground Coplanar Waveguide (GCPW) test structures...
Due to process variations at the very low technology nodes, the manufactured chips are grouped into different speed bins. Currently, various types of maximum operation frequency (Fmax) tests are performed for efficient speed binning by applying complex functional or structural test patterns, which incurs high test cost. In this paper, a novel on-chip Binning Sensor is proposed which can monitor the...
Objective: The stepped-frequency chirp signal is a wide band radar signal which can obtain high resolution range profiles. But when it come across phase discordance, the energy of target cannot be accumulated and the corresponding radar system cannot detect any targets. In order to resolve the effect of phase uncertainties, an novel phase error compensation method is proposed in this paper. Method:...
This letter proposes a new concurrent CMOS voltage-controlled oscillator (VCO). The oscillator consists of two sub-VCO operates at 4GHz and 6GHz respectively. The two sub-VCOs are coupled by a pair of MIM capacitors. The proposed oscillator has been implemented with the TSMC 0.18μm BiCMOS technology. By controlling the supply voltages, the VCO has three different operational modes, capable of generating...
This letter presents a lower power and wide locking range divide-by-2 with capacitive cross-coupled injection-locked frequency divider (ILFD) implemented in the TSMC standard 0.18 μm CMOS process. The ILFD is based on a capacitive cross-coupled VCO with one injection MOSFET for coupling the external signal to the resonator. The ILFD uses one 3-dimensional inductors to reduce the die area. At the supply...
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