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The scope of this paper is to study on corrosion failure mechanism of ceramic optocoupler under thermal stress. With this regard, a failure case for current transfer ratio (CTR) deviates is analyzed. Scanning electron microscopy (SEM) and energy dispersive X-ray microanalysis (EDX) are used to detect the failure position. The SEM study revealed that the passivation layer is the critical factor of...
The solder points cracking of a component with package of ceramic ball grid array (CBGA) type is studied in the paper. The cracking cause is found and the failure mechanism is clarified. The weakness of the package structure design is demonstrated by comparing the experiment results of two kinds of components, which provides guidance for the reliable design and application.
Failure analysis is very important in semiconductor business not only for customer satisfaction but also for process improvement and new product development. A successful failure analysis depends mainly on accurate failure verification, appropriate fault isolation techniques, and precise physical analysis steps implemented on the specimen. However, the trend in package development of current ICs makes...
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