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A novel and systematic methodology to predict the warpage of extremely thin packages is proposed. The geometrical and material inhomogeneities of both die and substrate are included in the prediction methodology. The inhomogeneous thermo-mechanical properties of dies due to the thermal incompatibility between silicon substrate and active/passive layers are inversely extracted from the Shadow Moiré...
In recent years, the IoT popularity pushes the package development of 3C products into a more functional and thinner target. For high I/O density and low cost considered package, the promising Fan-out Wafer Level Packaging (FOWLP) provides a solution to match OSAT existing capability, besides, the chip last process in FOWLP can further enhance the total yield by selectable known-good dies (KGDs)....
Traditional IC packaging requires chips to be assembled at the same level, while recently thrived 2.5D/3D IC packaging utilizes skyscraper approach to stack various types of chips with diverse functions occupying similarfootprint, and this approach not only can reduce overall package size, but also can improve electrical interconnection performance. The primary difference between 2.5D/3D IC lies in...
In worldwide semiconductor market has still inflated and required advanced, smaller, and lower cost package. From recently this situation, Fan-Out Wafer Level Package (FOWLP)/Panel Level Package has commercialized to fit for above demands. In this report, our three types of encapsulation materials, i.e., Liquid, Granule/Powder and Sheet encapsulation material, were expressed to apply for FOWLP/Panel...
Ultra-thin, panel-level glass fan-out packages (GFO) were demonstrated for next-generation fan-out packaging with high-density high-performance digital, analog, power, RF and mm-wave applications. The key advances with GFO include: 1) large area panel-scalable glass substrate processes with lower cost, 2) silicon-like RDL on large panels with 1-2 µm critical dimensions (CD), 3) lower interconnect...
Three-dimensional (3-D) digital image correlation (DIC) has been gradually adopted by industry these years. This method utilizes a pair of cameras to accumulate and correlate images through tracking the movement of features on the specimen surface in real time. It is capable of generating both in-plane and out-of-plane deformation during one test. To some extent, it is perfect to be utilized in the...
Large 2.5D IC leads the trend for Field Programmable Gate Array (FPGA), graphic, and network application. Chip module (CM) is comprised of top die and Si interposer, and underfill (UF) is fully filled between them. However, coefficient of thermal expansion (CTE) of UF is greater than 20ppm, and CTE mismatch occurs between UF and Si (CTE~3ppm). How to tune chip module warpage is a key for large 2.5D...
Handheld consumer electronics are requiring more complex packaging designs to accommodate higher component densities and reduce form factor. Fan-out wafer-level packaging (FOWLP) has garnered much attention lately as a cost-effective way to achieve high interconnect density and manage larger I/O counts within an affordable package. Two principal approaches to manufacturing FOWLP components have evolved:...
For years the IC industry has been driven by Moore's Law and the functionality that fits in a single die will double every 18 to 24 months. As minimum dimensions have shrunk from 28 to 20 to 16nm and now to 7nm, supposedly die size should shrink accordingly. But for the application of networking, things don't go that way. Nowadays we are in an era that the demand to improve networking performance...
Composing material combination of the re-distribution layer first type fan out wafer level package with various die occupancy ratio during the fabrication process on the support was studied by both of the making test vehicle and the numerical simulation. The investigated TV composed of glass support, temporary bonding adhesive, 1st re-distribution dielectric layer, Cu layer, 2nd re-distribution dielectric...
TSV-Free Interposer (TFI) technology eliminates TSV fabrication and reduces manufacturing and material cost. Co-design modelling methodology is established for TFI technology with considering wafer process, package assembly and package/board level reliability and thermal performance to optimize structure design, wafer process, assembly process and material selection. Experimental results are used...
The viscoelastic behavior of the molding compound in fine pitch encapsulated electronic packages has a significant impact on component warpage and SMT assembly reliability. This is particularly true for the thin or ultra-thin (such as fan-out) packages used in mobile handsets and tablets, where process-induced warpage behavior is exacerbated by a larger molding volume and higher density of Cu trace...
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