The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The importance of the mechanical behavior of electronic packages starts at the beginning of the package assembly process and continues through performance testing procedures at different levels. Predicting an electronic package's mechanical performance by simulation is an ongoing challenge and pursuit of both industry and academia. To achieve this goal, advanced simulation or analyses should have...
System-in-Package (SiP) is becoming more and more important in integrating functionality while reducing final product form factors and cost. This is particularly true for mobile applications where continued effort to achieve ever thinning products is continuously pushing development of new materials, components and assembly technologies. This presentation focuses on a SiP flip chip (FC) pad design...
Resin cracking is a common failure mechanism in electronic packaging using organic chip carrier. Chip carrier made of organic material has been industry standard for the past decade as they provide significant advantages over the ceramic dielectric-based predecessors in manufacturing cost and electrical performance. However, the CTE mismatch between the silicon chip and the organic laminate leads...
Silver (Ag) bond wires are increasingly used in semiconductor components to replace gold (Au) bond wires, and applications for these components are expanding from consumer to high-reliability electronic systems. To assess the impact of this technology transition on the overall component reliability, extended reliability testing beyond the typical JEDEC component qualification testing is needed. Additionally,...
This paper presents the demonstration of integrated passive devices on a 300mm mold-first FOWLP technology platform with 3 metal layers (Cu RDL) build-up. In this case, a low-temperature cure, negative-tone polyimide (PI) material is selected as the inter-layer dielectric. MIM capacitors were fabricated on top of M1 RDL layer with low temperature CVD deposited inorganic as the dielectric and typical...
The trend towards multi-die flip chip packaging favors the incorporation of a qualified manufacturingcompatible rework process to remove and replace individual defective die. Inherent to the rework process is an electrical verification step that effectively identifies the defective device without compromising the integrity of an otherwise perfectly functional device. Unfortunately, the very feature...
In this paper, carbon nanotube (CNT) and Ni-coating modified CNT (Ni-CNT) were compared as the reinforcing dopants in the Sn57.6Bi0.4Ag solder joints. The comparisons were made in three main aspects, including the dispersion of the dopants, the micromorphology evolution of the solder matrix and the reinforcement of reliability performance of the solder joints. The dispersion was evaluated via observing...
Recently, the electronics industry is moved maturely on the mobile/tablet market. The next fast growing opportunity market will be the Internet of Things (IoT) and Wearable Deivces in the near future. This advanced technology/package need to provide the ideal solution for small form factor, thin profile, high electrical performance, multi-function integration and low cost are the most critical requirements...
Copper/tin thermo-compression bonding technology has been a focus and hot spot of global research institutions for a long time. Inter-diffusion and intermetallic compound (including the metastable η-phase Cu6Sn5 and the stable ε-phase Cu3Sn) formation will occur at the bonding interface during the heating and pressing step of bonding experiments. Considering that tin is easily oxidized and copper/tin...
In this work, we have used nanoindentation methods to explore the creep behavior, and aging effects of SAC305 solder joints at several elevated testing temperatures from 25 to 125 oC. A special high temperature stage and test protocol was used within the nanoindentation system to carefully control the testing temperature, and make the measurements insensitive to thermal drift problems. Solder joints...
We developed a method based on cyclic voltammetrically measurements which allows corrosion sensitivity analyzes of typical metallization systems for substrates and electrical contacts in a very short time. Using a new electrolyte with innovative composition enables to combine the aggressive impact of the three standard tests in one procedure and initiates typical application related corrosion processes...
Over the past few years, temporary bonding has expanded together with the development of 3D stacked IC (SIC) technology. As maturity of the various processes has constantly improved, process yield and process impact on device performance have become key questions to answer. To further answer the refraining elements preventing a more massive technology adoption, in-line testing of the device throughout...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.