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In this work an investigation on dynamic stress development during switching operation of power electronic devices is presented. Two measurement techniques were used to analyze the behavior of devices which were mounted withelectrically conductive adhesives. A self-heated silicon test chip with CrNi-thin film strain gauge structures was developed. The heating function enables simulation of thermal...
Thermal compression bonding (TCB) is becoming an increasingly important process step in the assembly of advanced components such as fine pitch flip chip packages, system-in-package products, and 3D IC's. To increase the throughput and robustness of TCB processes, it is crucial to understand and control important process parameters like time, force and temperature. However, for TCB processes it becomes...
Recent advancements in automotive technologies, most notably autonomous driving, demand electronic systemsmuch more complex than realized in the past. The automotiveindustry has been forced to adopt advanced consumerelectronics to satisfy the demand, and thus it becomes morechallenging to assess system reliability while adopting the newtechnologies. The system level reliability can be enforced byimplementing...
Fan-Out Wafer Level Packaging (FOWLP) has recently seen a tremendous growth in a broad span of application in telecommunications, automotive and other markets. Its versatility allows its continuous development to accommodate more and more types of components. In light of expanding the technology to include new family of sensors such as MEMS/NEMS, Bio-chips with Microfluidics, magneto-resistive devices...
There are increasing interest in high temperature endurable sensor or device packaging solution for a set of wide ranging applications that include oil and gas production or deep sea exploration, advanced automotive application, aerospace, more electric aircraft initiative (MEA) or engine health management (EHM) systems, geothermal energy harvesting as well as other renewable energy industries. Besides...
In industry there is an increasing demand for reliable pressure sensors for applications in harsh environment. Pressure sensors working at high temperatures of 500 °C impose new challenges in packaging due to thermal cross sensitivity and temperature induced stresses on the package. Other major issues are to identify stable materials at high temperature and stress-tolerant sensor mounting techniques...
This paper describes initial development and testing of a novel high temperature capacitive pressure sensor system. The pressure sensor system consists of two 4H-SiC 11-stage ring oscillators and a SiCN capacitive pressure sensor. One oscillator has the capacitive pressure sensor fixed at one node in its feedback loop and varies as a function of pressure and temperature while the other provides a...
Thermo-compression bonding (TCB) is an important electronic packaging process which applies heat and pressure to form arrayed interconnections in simultaneity. TCB processes need to be optimized to ensure low thermal variation in order to produce uniform and reliable bonds. Due to the form factors and complex structures involved in TCB, it is difficult to determine thermal variations during bonding...
Lifetime reliability of electronics package is importantfor long term operation of microelectronic devices. Humidity, temperature and resulting strain are three mainreasons for the failure of a flip-chip semiconductor package. For these reasons, continuous research effort have been devotedto integrate moisture, temperature and strain sensorsin package performance and failure risk monitoring. Wehere...
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